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Great video! 👍 thank you!
Your Introduction to IC Packaging playlist is in the middle of your Physical Assurance and Inspection of Electronics playlist.
Many thanks.
Stacking of ICs one above other in layers connecting them together.
Great stuff. Can give more insights on test sockets and testing equipment ?
@11:57 is that Processor wire bonded to the substrate? is it a choice of the manufacturer? can we connect it using FC and BGA to make use of the space occupied by the wires?
could you please share the link for which you discuss about BGA PGA etc. Because videos are really shuffled in videos section
Thank you Sir.
question is what is packaging in the first place
semiconductor-wafer-slicon-substrate-gold-electronic compose of circle;
Thanks. ................ AUDIEO Please please make it louder.
Great video! 👍 thank you!
Your Introduction to IC Packaging playlist is in the middle of your Physical Assurance and Inspection of Electronics playlist.
Many thanks.
Stacking of ICs one above other in layers connecting them together.
Great stuff. Can give more insights on test sockets and testing equipment ?
@11:57 is that Processor wire bonded to the substrate? is it a choice of the manufacturer? can we connect it using FC and BGA to make use of the space occupied by the wires?
could you please share the link for which you discuss about BGA PGA etc. Because videos are really shuffled in videos section
Thank you Sir.
question is what is packaging in the first place
semiconductor-wafer-slicon-substrate-gold-electronic compose of circle;
Thanks. ................ AUDIEO Please please make it louder.