Possibly, ultrasonic shear can help shorten the anneal cycle by concentrating energy at the bond interface. Observing the ultrasonic reflections and transmissions can simultaneously verify bond quality.
Good presentation/review, but there seems to be a lack of clear credit given to the source material. There is a citations slide, but no indications of which information comes from which reference; also, a very large portion of the material came directly from the Intel presentation on the subject, Elsherbini et al "Enabling Hybrid Bonding on Intel Process", and this reference got a simple TH-cam link with no further details. Regardless, thanks for sharing, it was a good introduction.
Great overview of hybrid bonding.
What can you say about durability, long lifespan of Power management IC units in Chiplet
When will we get 2nm with chiplet packaging
When will we get 2nm with chiplet packaging
Possibly, ultrasonic shear can help shorten the anneal cycle by concentrating energy at the bond interface. Observing the ultrasonic reflections and transmissions can simultaneously verify bond quality.
how long is the anneal cycle and what is the heatsource?
이 아저씨가 제일 설명 잘 하는거 같아요ㅎ
Great Lecture!
Arey Bhaiya All Is Well
Any update of Hybrid Bonding “2”？
What is dicing purpose for placement accuracy?
Is it possible to get the slide deck?
No Mr Die, I want you to Bond
Good presentation/review, but there seems to be a lack of clear credit given to the source material. There is a citations slide, but no indications of which information comes from which reference; also, a very large portion of the material came directly from the Intel presentation on the subject, Elsherbini et al "Enabling Hybrid Bonding on Intel Process", and this reference got a simple TH-cam link with no further details. Regardless, thanks for sharing, it was a good introduction.
What can you say about durability, long lifespan of Power management IC units in Chiplet
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