Really informative , precise, detailed video… really helpful for those who have no clue about semiconductor packaging. It is very good that you explained all those steps in lay-man terms and not the fancy jargon … Thank you so much .. I will be looking forward to Part 2!
Thank you very much for making impressive video. This is absolutely perfect video due to you also add up real processing video including illustrator. I work for semiconductor industry for 16yrs still surprise the way you make video presentation. Please keep going.
i worked as a operator in diff.semiconductor before n i hve learn a lot from it...from phil.to taiwan semiconductor cmpny...i was also become a wrbond operator n a programer in a long run become a technician only for a work expiriencr
DBOCA thanks for the positive comment. After 30 years I thought it is time to share the knowledge and experience that I think will be helpful for beginners in the industry and even for those just graduating from college / university. I miss it too! Watch out for more upcoming videos
Hi! Fantastic video! It is the most detailed video existing. But I don't understand how dies of extremely small size, few tenths of millimeters, like the dies of small transistors like the BC337, can be sawed and separated from the plastic film, without the get pushed away. And how they can be picked up to be transported on the final package. Please could you explain me it, or make a next video for it?
Thanks for the comment. The wafer saw video I posted will give better understanding of the sawing process. I will also create a more detailed video related to die attach process.
@@watchlearnnplay Thank you for your reply! Yes I watched also the video about the wafer sawing. It's very good too! but the dies in the video are big. I can figure how it may work with large dies, but with very small dies, few tenths of millimetres large, it is all different to handle, I guess. Then I am looking forward to watch your video about the die attach! :) Also concerning large dies, how are they exactly picked up from the wafer, without being damaged? As far I know, nothing should touch the upper surface of a diffused and finished chip, otherwise the material, the structures and tracks would be damaged and the chip would be unusable. Or not? With sub-millimetre dies it is even more difficult. Thank you again for your great videos. Do you work in a semiconductor factory?
this is really great video and great explanation. maybe it is worth to compare or to explain the new "panel-level-packaging". seems to be new packaging technology. would be great to learn more about it.
Thanks for the feedback. I intentionally did not include the links in the description as I want the focus to be on the learning video. I mentioned the reference video mainly o give credit and respect to the original creator.
The best illustration Semiconductors wafer, chips and devices such as transisors. I hope this discussion be extended to Field effects transistors such as MOSFETS, POSFETS, and Biosensors.
Really informative , precise, detailed video… really helpful for those who have no clue about semiconductor packaging. It is very good that you explained all those steps in lay-man terms and not the fancy jargon … Thank you so much .. I will be looking forward to Part 2!
Thanks for the comment. More videos to come
Thank you very much for making impressive video. This is absolutely perfect video due to you also add up real processing video including illustrator. I work for semiconductor industry for 16yrs still surprise the way you make video presentation. Please keep going.
i worked as a operator in diff.semiconductor before n i hve learn a lot from it...from phil.to taiwan semiconductor cmpny...i was also become a wrbond operator n a programer in a long run become a technician only for a work expiriencr
very informative yan Sir LGALE......one of most respective Equipment Engineer during our Semicon time...i really miss it!!!......keep it up!!!😀
DBOCA thanks for the positive comment. After 30 years I thought it is time to share the knowledge and experience that I think will be helpful for beginners in the industry and even for those just graduating from college / university. I miss it too! Watch out for more upcoming videos
Thanks!
I study computer science and this was very useful for my computer network architecture class
very good process introduction and easy to comprehend, thank you so much !
Thank you for making detailed video. Is DIE attached with wafer tape?
Thank you for the very informative video sir! We hope you continue to share more of your knowledge po :D Test Engineer here
I had work with the position Process Engineer of Wire Bonding stage for one year. I miss KNS Maxum +, Iconn machine.
Is this somewhat the process at the Intel back end semiconductor factory?
Very impressdive. easy to understand for beginners. I learnt a lot from this video. Thank you.
really informative and good explanations. thank you very much for this useful vidios
Hi! Fantastic video! It is the most detailed video existing. But I don't understand how dies of extremely small size, few tenths of millimeters, like the dies of small transistors like the BC337, can be sawed and separated from the plastic film, without the get pushed away. And how they can be picked up to be transported on the final package. Please could you explain me it, or make a next video for it?
Thanks for the comment. The wafer saw video I posted will give better understanding of the sawing process. I will also create a more detailed video related to die attach process.
@@watchlearnnplay Thank you for your reply! Yes I watched also the video about the wafer sawing. It's very good too! but the dies in the video are big. I can figure how it may work with large dies, but with very small dies, few tenths of millimetres large, it is all different to handle, I guess. Then I am looking forward to watch your video about the die attach! :)
Also concerning large dies, how are they exactly picked up from the wafer, without being damaged? As far I know, nothing should touch the upper surface of a diffused and finished chip, otherwise the material, the structures and tracks would be damaged and the chip would be unusable. Or not? With sub-millimetre dies it is even more difficult. Thank you again for your great videos. Do you work in a semiconductor factory?
This video is very informative. Thanks for doing this.
your video sharing is very informative. Thanks for provided
Very good information. Thanks for sharing.
this is an EXCELLENT video! thank you very much!
Very very good video! Thank you!
This is amazing! Keep the great videos coming.
awesome ilustration, thanks for sharing. the next video plz explain about how lithograpy work.
Thanks for the feedback.
this is really great video and great explanation. maybe it is worth to compare or to explain the new "panel-level-packaging". seems to be new packaging technology. would be great to learn more about it.
Excellent! Very detailed. Fantastic info; can't find this elsewhere. Bravo pal.
I'm glad I watched this *after* I delidded my CPU to apply new TIC to the die. I would've felt like I was diffusing a bomb.
Please provide information regarding micro bump and hybrid bonding in 3D ICs
So helpful I hope you can continue making videos
Very informative, thank you
Thank you very much. Very informative. God bless
Very informative 👍. Thank you. One request, can you please cover the process of Wafer manufacturing
GOOD VIDEO EXCELLENT EVEN ... EXCEPT Why didn't you include the full TH-cam video links in the description?
Thanks for the feedback. I intentionally did not include the links in the description as I want the focus to be on the learning video. I mentioned the reference video mainly o give credit and respect to the original creator.
Very good video sir...👍👍👍
Great video! 👍
Great content !
Can you create more videos about semiconductor process?
Great video man!!!! Thank you so much ❤
excellent Video
Weldon sir
Hi, your slide and explanation are really good. Do you mind to share your slide?
thank you for sharing
The best illustration Semiconductors wafer, chips and devices such as transisors. I hope this discussion be extended to Field effects transistors such as MOSFETS, POSFETS, and Biosensors.
Practical video
learn a lot about process flow .
Semiconductor assembler here...
this is great.
slay, ur accent is fine :)
Galing pre
amazing
Is this a filipino channel? if so, salamat sa kaalaman kabayan. new test engineer po ako.
Salamat din kabayan
I watched this on my phone while my teacher is presenting this
Happy to know that my video is useful for teaching / learning.
Thanks you for useful video, if you have powerpoint file please share to me, I’m really grateful!
Semiconductor project
Bapak pamudjiid