RealIZM Figure of the Month: 300 mm Wafer Process Line

#Figureofthemonth
The Fraunhofer IZM-ASSID “All Silicon System Integration Dresden - ASSID” has a 300(200)-mm 3D wafer-level process line with modules for TSV formation, pre-assembly, wafer-level assembly and stacking.
Our colleagues at the Dresden site focus on process development, material and system evaluation as well as R&D services and prototyping in the field of packaging technologies for 200 mm and 300 mm wafers.
You can read the interview with Dr. Manuela Junghähnel, site manager of Fraunhofer IZM-ASSID, on our science blog for microelectronics:
blog.izm.fraun...
#NewsfromRealIZM #FraunhoferIZMBerlin #wafer #systemintegration #packaging
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