Double Patterning to the rescue (LELE, LFLE, SADP) - Part 1

Introduction to Double Patterning which is used extensively for printing transistors and other features in front end of line (FEOL) flow in a semiconductor chip.
This video also introduces the various processing options to achieve double patterning i.e.
1. Litho Etch Litho Etch (LELE)
2. Litho Freeze Litho Etch (LFLE)
3. Self Aligned Double Patterning (SADP)

[@ashwanisirohi]

Wonderful.....you have skill to explain the technical things wonderfully, precisely and with ease.

[@hansrx7]

Thanks for the clear and lucid explaination

[@我想想-e5d]

Wait! why there is no wash process in LEFE? especially with two hard mask material remain, there may need more than one process two wash away those materials. Actually 5~6 steps in the process.

[@joonkim6610]

Thanks for your clear explanation.

[@traceynewton8699]

I really enjoy your videos. Thank you!

[@gamitheshkumar3725]

Very good explanation..
👌👌

[@nephewniece3312]

Hi, what are the drawbacks when come to physical design not relate to manufacturing?

[@yerravellyvenu1071]

HI,
In Litho Freeze Litho Etch (LFLE),without etching, how you will get step 3

[@Kie-7077]

2018 says hello, it's quad-patterning now and we still can't get euv to work well enough.

[@nephewniece3312]

CN u send ur email

[@umarao2711]

Can you explain how we will pattern (yellow lines) in step1 of LELE process

[@azizbedoui5606]

thank you bro

[@유명한-c7h]

Nice explanation

[@sagarkore9648]

Nice Explanation

[@AnotherMlbbPlayer]

Wjy they are using silicon dixode

[@bloomi2542]

Scott Thompson uwu daddy

[@neilmcmahon]

Very difficult to listen to this guy will all his uhhs and ahhss

[@GAURAVYADAV-yv3lh]

Nice Explanation