ERI Summit 2020: Heterogeneous 3D Microsystems: Design, Fabrication, and Packaging

Plenary Speaker
Dr. Philip Wong, Vice President of Corporate Research, Taiwan Semiconductor Manufacturing Company (TSMC); Professor, Stanford
Co-packaging Heterogeneous Microelectronics and Optical Input/Output (Related Programs: CHIPS, PIPES, Navy: SHIP)
Dr. Gordon Keeler; DARPA
Mr. Sergey Shumarayev, Intel
Dr. Mark Wade, Ayar Labs
Mr. Brett Hamilton, Naval Surface Warfare Center (NSWC) Crane
3D Heterogeneous Integration and the Future of Data-Centric Computing (Related Program: 3DSoC)
Dr. Jason Woo, University of California Los Angeles
Dr. Max Shulaker, Massachusetts Institute of Technology
CMOS-Like Heterogeneous Integration Lightning Talk
Dr. Tom Kazior, DARPA
Visit eri-summit.darpa.mil/ for more details on the ERI Summit.

[@fleXcope]

CTO of TSMC gave a lecture on Heterogeneous Integration at DAPRA. Impressive.

[@icarustheother8591]

Pretty cool stuff I wish I didn't understand so much I'm looking for the Marine corps however be right back

[@dejiamoo]

Watch for those that may want to steal this IP (Chyna).