2.5 D & 3D Chips: Interposers and Through Silicon Vias

Advantages of 3D/2.5D chips. Challenges in making 3D chips using Through Silicon Via (TSV)
Stanford University's class on nanomanufacturing, led by Aneesh Nainani.
Oct 29, 2012
Week 6, Lecture 11, Part 3

[@gauravsyal]

One of the best video on 2.5D vs 3D

[@rajattiwari4408]

Great Explanation

[@hikguru]

Very informative. Much better than reading papers.

[@himanshur2035]

It was a good descriptive session and very informative. Thank you for uploading

[@mjl7810]

This is a great presentation, thank you!

[@MegaFLOSSer]

Very good and understandable explanation. TSV for Dummies like myself. Thanks for putting it on the i'net.

[@paudelkeshab]

Very informative ! Thank you.

[@amazingtrucks]

Excellent Video

[@rithunrajkrishna7577]

Where can I get the latest advancements in this field? Thanks again for this lecture

[@omarkebichi9231]

nice presentation