RF Design-11: RF Circuit Design with Custom 3D Components

Workspace used in this video can be downloaded from Keysight KnowledgeCenter: edadocs.softwa...
RF designers often face a dilemma as the values needed for circuit components are not the standard ones offered by various manufacturers. Using newer capabilities offered by ADS 2021 and EMPro 2021, this job is a lot easier as designers can create their own custom 3D components such as Coil Inductor etc, and use the same in their circuit designs. Watch this tutorial to go over a step by step approach to accomplishing this task very easily.

[@ashishmesa]

Yet Another Great Tutorial ,hats off to you, Waiting for your series on PA Design.

[@BhargavaAnurag]

Working on it

[@hamidk4772]

Outstanding Job.

[@BhargavaAnurag]

Thank you! Cheers!

[@HugePlays]

Amazing job, thank you!

[@BhargavaAnurag]

Glad you liked it!

[@yuliaprigara7778]

Hi, how do you start EMpro? When I start it from a layout window, I don't get the same menus as you do. I don't have a menu for importing CAD files, like STEP. Thanks.

[@BhargavaAnurag]

Hi Yulia,
You can download and install latest EMPro version from Keysight. Its a different installer and software from Keysight for 3D CAD and Simulation.

[@ltteogoali7251]

hello, i have a question about multilayer design, first thing, thanks for your videos they are very helpful, now about the question, i want to put some componets on top layer and other on bottom layer, can i do that with just one substrate, and make the ground be on both layers and use vias, or should i have at least two substraate with the ground be beween the two substrate?.

[@BhargavaAnurag]

Hi Luck, It depends...sometimes designers have 1 GND plane between Top and Bottom and sometimes you have 1 GND plane for Top and another for bottom layer with a Core dielectric in between in order to isolate as much as possible. While doing so, you need to be careful in not having too many VIAs as each VIA will have some inductance and you would like to avoid that in order to preserve the proper high frequency performance.
As I said before, its not always so easy to squeeze the size and many time you will need to live with what you have. Multilayer is not always the solution and in many cases it might create more problems so you need to treat every aspect carefully.
Unfortunately, TH-cam is not good place for tech support and I will recommend you to work with somebody local or with a proper consultant who can advise you properly.

[@PiotrOsuch]

Very useful material

[@BhargavaAnurag]

Glad you think so!

[@dineshvenkatachalam3764]

Hello sir, Your sessions are very informative. I have struggled a lot while doing my Ph.D. to know about the basic features of the simulation tools. Today these videos will be more useful for the engineers who do projects in the RF domain. Now we are designing an isolator for S-band. Can you provide any tutorials or web links to get the schematic details with equations?

[@BhargavaAnurag]

Unfortunately, I don't have hands-on experience with Isolator design so can't help much but pls contact your local Keysight tech support team for help and they may have something which will be useful for your work.

[@dineshvenkatachalam3764]

@@BhargavaAnurag Thank you for your reply sir

[@Rajput.1101]

USB to RF converter using ulp microcontroller.pls design it.

[@BhargavaAnurag]

Hi Neeraj,
Unfortunately, I have no experience with that stuff so can't be of much help to you.

[@mesmith5706]

excellent 💗

[@BhargavaAnurag]

Thank you! Cheers!