Come visit us for a week of microsoldering training in Western New York at Practical Board Repair School! www.ipadrehab.com/index.cfm?Page=Practical-Board-Repair-School
Impressive . . most impressive! I normally use an underfill remover liquid that Mechanic makes. It's awesome stuff, but it can take quite a bit of time to work its magic, and it can also make a bit of a mess, so I'll definitely be giving this method a spin. Always nice to have an extra technique in your back pocket. And BTW, I'm also a fan of high heat, high air, and do it fast fast fast; I'm with ya on the 400° C method. Thanks for demoing this! I always learn something when I watch your videos, so thanks again! 😀👍
Back when iphone 7 c12 jumper was a raging repair I would pre heat my board to around 90C thinking I was helping however was always popping out ball from the underfiller BB-PMIC on the other side making more work, and then I just started hitting audio ic hard and fast no pre heat like this and had way more success. Re ip13 thermal id 3 minute reboot I had one last month that looked like charge port but ended up needing a jumper from charge fpc to power flex fpc hard to explain but its a broken trace on the top layer kinda like some ip8's are showing recently. Re USB-C for iPhones my prediction is they will use a similar setup as the MacBook where a CD32 like chip will be in charge of talking and sending the gate high or low and you bet we wont be allowed to buy it
Yes I have solved x800 and it not the charge port It either the interposer or Vibration IC Or if there a high diode reading on clock specifically on I think it was AOP line on the charge port it a no fix economically a cpu reball worked to fix it the reading.
I recently started designing PCBs in KiCAD, and the component density of these iPhones is just next level insanity. To be fair, though, I'm guessing there's at least 6 layers just so you can maneuver those traces where they need to go. I'm actually freaking out a little seeing all those tiny SMD bits crammed in there.
Very close to our "point blow" method, in which we blow the chip with high temperature intermittently, about twice per second, to prevent the heat from accumulating in the board.
I would be afraid of ripping off pads. The method that i use if placing the logic board on a preheater at 160 degrees then using 300 degrees with the hot air station after 20 seconds the chip is ready to go
Yes, we never re-use underfilled ics, always replace. So you either "spare the board" like with this method, or you "spare the chip" if you were harvesting the chip from a donor board. We would not reuse an underfilled ic because it has no way to become damaged where simply removing it and putting that same chip back would solve a problem. Water does not go under the chip because of the underfill. So crack in the chip and electrical damage are the only reason we would be removing an underfilled ic on a repairable board. I hope this makes sense.
Hi Jessa.. i have iphone xr, but when i press power button ampere up to 0.35 and than back to 0 again, and over again.. if , i unplug nand ic,.. the device on dfu mode.. i have to change nandflash, there still stuck on dfu, and dont wont to recovery mode when i flashing with 3utools or itunes.. i have to check voltage on nand ic and there is normal voltage.. how we fix that.. thank you Jessa
Come visit us for a week of microsoldering training in Western New York at Practical Board Repair School! www.ipadrehab.com/index.cfm?Page=Practical-Board-Repair-School
I like this method, I will give a try. Thank you
Wonderful example of this, thanks Jessa
Impressive . . most impressive! I normally use an underfill remover liquid that Mechanic makes. It's awesome stuff, but it can take quite a bit of time to work its magic, and it can also make a bit of a mess, so I'll definitely be giving this method a spin. Always nice to have an extra technique in your back pocket. And BTW, I'm also a fan of high heat, high air, and do it fast fast fast; I'm with ya on the 400° C method. Thanks for demoing this! I always learn something when I watch your videos, so thanks again!
😀👍
Off the grid
(Years ago black widow used blast off to rock a train station)
Gracias Jessa! Siempre aportando
Thank you, Dr. Jones!
Back when iphone 7 c12 jumper was a raging repair I would pre heat my board to around 90C thinking I was helping however was always popping out ball from the underfiller BB-PMIC on the other side making more work, and then I just started hitting audio ic hard and fast no pre heat like this and had way more success. Re ip13 thermal id 3 minute reboot I had one last month that looked like charge port but ended up needing a jumper from charge fpc to power flex fpc hard to explain but its a broken trace on the top layer kinda like some ip8's are showing recently. Re USB-C for iPhones my prediction is they will use a similar setup as the MacBook where a CD32 like chip will be in charge of talking and sending the gate high or low and you bet we wont be allowed to buy it
thanks
Yes I have solved x800 and it not the charge port
It either the interposer or Vibration IC
Or if there a high diode reading on clock specifically on I think it was AOP line on the charge port it a no fix economically a cpu reball worked to fix it the reading.
I recently started designing PCBs in KiCAD, and the component density of these iPhones is just next level insanity. To be fair, though, I'm guessing there's at least 6 layers just so you can maneuver those traces where they need to go.
I'm actually freaking out a little seeing all those tiny SMD bits crammed in there.
Same.
I've heard it called "ball squeezeage".
Electronics Repair School also does the high heat fast removal technique, ie, 450-480ºC.
I've never seen him rework an underfilled BGA. Any chance you remember what device he did that on?
Very close to our "point blow" method, in which we blow the chip with high temperature intermittently, about twice per second, to prevent the heat from accumulating in the board.
Excellent😊 hello from Puerto Rico 🇵🇷
I would be afraid of ripping off pads. The method that i use if placing the logic board on a preheater at 160 degrees then using 300 degrees with the hot air station after 20 seconds the chip is ready to go
Whit pro heater??? perhaps its more eazy
This method is good but it only applicable when you are going to change the ic's but not in reusing the ic's.
Yes, we never re-use underfilled ics, always replace. So you either "spare the board" like with this method, or you "spare the chip" if you were harvesting the chip from a donor board. We would not reuse an underfilled ic because it has no way to become damaged where simply removing it and putting that same chip back would solve a problem. Water does not go under the chip because of the underfill. So crack in the chip and electrical damage are the only reason we would be removing an underfilled ic on a repairable board. I hope this makes sense.
never pulled some weaker traces with this method?
Would you that with the RAM of a CPU (Snapdragon 888 in my case) as well?
Hi Jessa.. i have iphone xr, but when i press power button ampere up to 0.35 and than back to 0 again, and over again.. if , i unplug nand ic,.. the device on dfu mode.. i have to change nandflash, there still stuck on dfu, and dont wont to recovery mode when i flashing with 3utools or itunes.. i have to check voltage on nand ic and there is normal voltage.. how we fix that.. thank you Jessa
Sorry if I missed it, what temp did you use for this method?
Super crazy hot. You have to figure it out for your station, mine is very different than most other stations
Why aren't you afraid of lifting pads?
TH-cam dont want you to grow... i never get the lives for your channel....