After Café: Improving Device Quality and Reproducibility: Thin Film Adhesion Failures

In this presentation, Bob Hengstebeck, research faculty at the Materials Research Institute, Penn State, speaks on the topic, "Improving Device Quality and Reproducibility: Thin Film Adhesion Failures." Whether during initial development of a device, in the scale up for manufacturing, or during an established manufacturing process, engineers often need to address thin film adhesion failures. This talk will highlight some of the methods available within the Nanofabrication Laboratory and MCL to characterize adhesion failures and thus help identify the necessary process modifications required to increase device quality and/or reproducibility. We will use an example of a failure that occurred at a metal contact layer on a passivation oxide to walk through the testing decisions that lead to an understanding of the root cause.
The weekly After Cafés are 30-minute talks about the Penn State MCL's analytical capabilities.
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