RENA InEtchSide 4 - High throughput next generation rear side etching

The RENA InEtchSide 4 automated processing equipment is designed for ultra-high GW-scale throughput removal of silicon oxide layers and doped glasses (e.g. PSG or BSG). The patented single side etching process ensures lowest chemical front side attack, it is proven and optimized for high efficiency solar cells. This is used in the fabrication of various solar cell concepts, like IBC, PERC, TOPCon and others. The tool is a further development and based upon the RENA NIAK 4 inline platform.
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