I KILLED A 5700g ;-;-;;;-;-;-;-;- The Die split because I delidded it with the grain instead of against it. Don't go all the way to the edge -- leave a few mm from the PCB edge before you hit it. Also just delid it in one direction only -- two ways causes issues with uneven force distribution and excessive bending on one side of the die, with a tendency to tear upwards -- a big nono
13100F Delidded for literally no reason :) th-cam.com/video/lZjck0pzrLY/w-d-xo.html Check it out I guess, I got the world record because no one else has bothered to OC the damn thing. 4.6GHz single core 4.4 All core with 4373MHz Ram on a B660m mortar max motherboard
You are the only source I found showing dissasembly and lapping the AM4 socket - delidded an old 3700x - lapped an old b450-f mobo socket - now liquid metaled and direct die cooled under an old H100i AIO - now I have a supidly fast and cool testbench lol
You had me with Vice... love it. people might think this is Jank but its the same concept as the grizzly delidder just not as stable .... more risk sure but there is always risk w ith a delidding.
Very good work here man! It seems hard to do at the beginning, too much hassle and everything, but worth it! Just wanted to ask you, does this method apply to a Ryzen 5 5600X too, or does not? And will doing this help in my game performance and temperatures? I've got a 5600X, not G variant like you, since X variant has a little bit more horse power, but I would really like to do this with my rig without destroying my entire PC! 😂
that's going to be a sus move, since the chiplet layout is dual die compared with the single layout of the G variant. You'd need to preheat the CPU a little with a hairdryer until it hurts your finger to touch the lid. And it's going to be the best idea to only move it in 2 directions to delid. The other issue is the capacitor layout on the outside, and how it can shear off if it's way different from the 5600G
@compuguy123 Damn, that sounds too risky to be of any benefit, since if I were to damage any of the capacitors in the trying process, I would literally be spending €130 for nothing, because it would render it useless. Then I guess it would be better idea to just stick with the factory IMS CPU plating, and just use liquid metal instead of thermal paste and go with the perfect Asus ROG Strix water cooling. But anyways, thanks for the warning, you just saved my CPU from the certain doom. 😅
😢but are all 5000 series totally same when opening lid? As one side of cpu inside had components really to the edge so if on a wring side I tried to push the nickl plate the cpu is domed..ooh it's never supposed to be easy I guess
so wouldnt' it be better to delid, clear of the orig iridium paste, then liquimetal the thing back with the original cap ... probably the black glue will stick again when the heat applies for 15-20mins (i.e. some 100% CPU testrun for such a time) and it will look stock but will be ofc better - that way the next owner will not be sheetless scaried when remove da fan, and the temps would be ok
i was thinking of delidding my 5900x, i was having problem looking how to direct die it but on your video you said if i use a thermalright pa 120, i dont need to sand down the cpu socket? and do i need any modification on my cooler for the cooler and cpu die to get in contact?
How many millimetres should you sand the socket mechanism? I'm wanting to attempt this myself with a 5600x. I'm using an EK Supremacy water block, so the socket will need decent sanding. I believe the die height on the 5600G and X are the same due to the IHS having the same depth profile. None the less, great video dude! You earned a new sub!
The socket needs to be sanded until when you hold it up to the light there's a clear air gap between the hand tightened cooling block and the socket lip.
@@compuguy123 I actually made a post on R/Overclocking over on Reddit for my findings. Hopefully you find it interesting, it was a tonne of work and sanding. I have since replaced my thermal paste with liquid metal since the post went live. Edit: The post title is 5600X direct die testing I would link the post but YT doesn’t like that much. Stay cool dude 🤟
@@compuguy123 I'm back for direct die testing round 2. I've just ordered an MSI B550 Unify - X (My old motherboard died from a failed PCH :[ ), this is a 1 DIMM per channel motherboard, 14 phase VRM with 90Amp power stages, its mega F***ing overkill, I will be testing max memory and core clocks on my 5600X (direct die ofc, will need to sand the socket). I will later be getting an upgrade to a 5700G (also direct die). I heard that you can easily push the fabric clock on the Cezanne APUs to like 2400 - 2500Mhz. Regular MCM (Non monolithic) Ryzen can only max the Fabric at 1800 - 1900Mhz (2000Mhz if you have a golden chip). Edit: Instead of sanding the CPU die when running direct die, I will be using some solder wick alloy (Liquid-metal like alloy that absorbs the indium solder on the die, no sanding needed). If ur interested, I'll let ya know when I get the motherboard in and begin testing (I'll keep ya posted).
@@compuguy123 Sup. I just got a 5700G in my rig. How th did you get an all core 4.6Ghz stable with only 1.25v Vcore? My chip needs 1.35V for 4.4-4.5Ghz using PBO (not even all core) for stability with OCCT AVX and SSE. Any lower voltage results in a system restart. If I disable all CPU cores but 2 I can run 4.6Ghz stable with 1.25V (haven’t tried lower). Did you win big on the silicon lottery? Or did I just get super unlucky. Edit: Did you run voltage / frequency tests before the delid? Is the delid what allowed you to run 4.6 all core stable?
yes but make sure the lapping paper is super fine to finish and even to start; Use 3000 grit and then 6000 grit so that the liquid metal can stick to the surface properly
Lapping was to make it more flat. For the 5600x you need to be very careful as it's a dual chiplet chip. You may need to preheat the chip to at least 100C and take extreme caution to avoid destroying the capacitors around the die.
@@rl4416 The issue is that the capacitor config is very close to the edge of the metal lid - which means moving more than 1mm could potentially catastrophically shear off most of the capacitors on the chip itself.
True but also remember that the copper of the surface will absolutely eat through your liquid metal in a few months. The Indium will bond with the surface of the copper and seep deeper, so eventually it will harden. If you have slightly more it will prevent that from happening as easily or quickly.
That's true but this still drops it by quite a few degrees. Although going for the pure core speed here seems to have dropped the memory speed cap a little due to the lack of a massive EMI and cosmic ray shield.
The solder quality of AMD CPUs can be quite spotty. Despite lapping the IHS sometimes the ryzen 3600's and 5600g's can have high hotspots exceeding 10*C due to air pockets in the soldering.
@@compuguy123 I see, was mainly asking because I am planning on doing that after getting inspired by a recent der8auer video and am looking for tips :D
I just bought a used rig with a surprise delidded 5600g....stock Wraith cooler ...it hangs up on the socket and the mobo what a nightmare dude says 85* temps are okay I put on cinebench and has single cores up to 95* in under a minute...I don't even have the lid...I may just hack up the Wraith cooler. Who delids a soldered ihs only to put a stock cooler on-top?? smh Lapping the die was a nice touch btw
What in the hell is that?! These things run horribly without LM to act as a heatspreader. Its concentrated on the centre of the die. You can get a nice AIO for it, just make sure to use LM and to sand down the AIO plate first, because 9/10 of them will use copper with enamel on it to stop rust.
@@compuguy123 I drove to get the ihs from the guy, lapped it real nice sandwiched it between a Wraith prism and the die with mx4... Found a 120mm mod to 3d print...doesn't get over 75c no matter what I throw at it...still can't believe the guy delidded this thing to begin with
@@compuguy123 don’t think you show how you did the overclock in bios or software I can only seem to find info on the a520 saying online can only overclock through the bclk?
Ow wow. I expected the iGPU to be a chiplet next to the 6 or 8 core CPU chiplet. But no it looks like just a regular monolithic die. This needs more investigation! Explains why the G CPU's only has half the cache! Even the 5700G got only half the cache of a 5600... 5600g for a Linux machine / media center is just killer. There are laptop grade G's out there that are also cool. But the 5600G is standard ATX. Got a 5600G and it is doing surprisingly great for a stopgap. Only complain I had was that Firefox ran really poorly on it but right before getting a 5800x3d or 5900x (not sure yet) all complains with the G is gone. It is still not a beefy GPU but wow how far the 5600G can get me after Firefox started to behave. It really is only in games and Blender eevee viewport (walking around the scene) I notice slowdown. The CPU alone is really impressive. But the GPU even with questionable browser acceleration is just awesome. Most AM4 boards can slot in a 5600G and become a really good compact low noise machine. That was why I picked the 5600G since it is going to have a good life in a other system when I upgrade. But with dedicated GPU a 5600 is probably a better pick. But 5600G was a really good GPU purchase a few months ago! Ha! Let us hope AM5 is going to bring more of this fantastic APU's! The fact that cable clutter is starting to take up more space then the hole computer is nuts. No need for PCIE when a APU can fool you into thinking your running a full tower PC.
It's completely monolithic, which also means that there are issues with the IO dropping out if the distance to core and power delivery lines are too small - hence why B550 has that many issues that AMD could not resolve despite 10 bios updates
💀 la primera vez que veo a alguien lijando el socket. El metal liquido sólo debe aplicarse sólo cobre prácticamente 😳, apenas sobre zinc. Nunca aluminio
This is the jankiest deliding video I have ever seen and ever witnessed in my life. Never stop. Please do more.
I KILLED A 5700g ;-;-;;;-;-;-;-;- The Die split because I delidded it with the grain instead of against it. Don't go all the way to the edge -- leave a few mm from the PCB edge before you hit it.
Also just delid it in one direction only -- two ways causes issues with uneven force distribution and excessive bending on one side of the die, with a tendency to tear upwards -- a big nono
13100F Delidded for literally no reason :) th-cam.com/video/lZjck0pzrLY/w-d-xo.html Check it out I guess, I got the world record because no one else has bothered to OC the damn thing. 4.6GHz single core 4.4 All core with 4373MHz Ram on a B660m mortar max motherboard
You are the only source I found showing dissasembly and lapping the AM4 socket - delidded an old 3700x - lapped an old b450-f mobo socket - now liquid metaled and direct die cooled under an old H100i AIO - now I have a supidly fast and cool testbench lol
MADMAN. SOMEBODY STOP HIM.
You had me with Vice... love it. people might think this is Jank but its the same concept as the grizzly delidder just not as stable .... more risk sure but there is always risk w ith a delidding.
No, I'm not cutting my nails, they are part of my toolkit
this is torture. I want more
There is already more. I've delidded a 13100f (video is on channel page), more to come when I delid a 12100f and OC it past 5GHz on water
Very good work here man! It seems hard to do at the beginning, too much hassle and everything, but worth it! Just wanted to ask you, does this method apply to a Ryzen 5 5600X too, or does not? And will doing this help in my game performance and temperatures? I've got a 5600X, not G variant like you, since X variant has a little bit more horse power, but I would really like to do this with my rig without destroying my entire PC! 😂
that's going to be a sus move, since the chiplet layout is dual die compared with the single layout of the G variant.
You'd need to preheat the CPU a little with a hairdryer until it hurts your finger to touch the lid.
And it's going to be the best idea to only move it in 2 directions to delid.
The other issue is the capacitor layout on the outside, and how it can shear off if it's way different from the 5600G
@compuguy123 Damn, that sounds too risky to be of any benefit, since if I were to damage any of the capacitors in the trying process, I would literally be spending €130 for nothing, because it would render it useless. Then I guess it would be better idea to just stick with the factory IMS CPU plating, and just use liquid metal instead of thermal paste and go with the perfect Asus ROG Strix water cooling. But anyways, thanks for the warning, you just saved my CPU from the certain doom. 😅
Had to slow it down to half speed, to understand the dialog.
Yeah man - why put the stupid music when you are actually talking?!
😢but are all 5000 series totally same when opening lid? As one side of cpu inside had components really to the edge so if on a wring side I tried to push the nickl plate the cpu is domed..ooh it's never supposed to be easy I guess
You crazy bastard I loved it
so wouldnt' it be better to delid, clear of the orig iridium paste, then liquimetal the thing back with the original cap ... probably the black glue will stick again when the heat applies for 15-20mins (i.e. some 100% CPU testrun for such a time) and it will look stock but will be ofc better - that way the next owner will not be sheetless scaried when remove da fan, and the temps would be ok
Nah, you need to sand down the heat spreader tons from the top and the bottom in order to actually have the temps not shoot up to 50 on stock clocks.
Although, if you value memory clocks, delidding it and then relidding is not a bad idea since it also provides a shield against radio interference
Maybe I'm wrong, but it kinda looks like the die had some liquid metal already.
That's the indium solder, so technically yeah, but it's not exactly liquid metal
thank you for video bro
i was thinking of delidding my 5900x, i was having problem looking how to direct die it but on your video you said if i use a thermalright pa 120, i dont need to sand down the cpu socket? and do i need any modification on my cooler for the cooler and cpu die to get in contact?
Yes and yes you do. Be careful of multi die CPUs, they risky.
I'll do this to my 5600g after the warranty period is over.
How many millimetres should you sand the socket mechanism? I'm wanting to attempt this myself with a 5600x. I'm using an EK Supremacy water block, so the socket will need decent sanding.
I believe the die height on the 5600G and X are the same due to the IHS having the same depth profile.
None the less, great video dude! You earned a new sub!
The socket needs to be sanded until when you hold it up to the light there's a clear air gap between the hand tightened cooling block and the socket lip.
@@compuguy123 I actually made a post on R/Overclocking over on Reddit for my findings. Hopefully you find it interesting, it was a tonne of work and sanding. I have since replaced my thermal paste with liquid metal since the post went live.
Edit: The post title is 5600X direct die testing
I would link the post but YT doesn’t like that much. Stay cool dude 🤟
@@P2PC gotcha back g 🤟
@@compuguy123 I'm back for direct die testing round 2. I've just ordered an MSI B550 Unify - X (My old motherboard died from a failed PCH :[ ), this is a 1 DIMM per channel motherboard, 14 phase VRM with 90Amp power stages, its mega F***ing overkill, I will be testing max memory and core clocks on my 5600X (direct die ofc, will need to sand the socket). I will later be getting an upgrade to a 5700G (also direct die). I heard that you can easily push the fabric clock on the Cezanne APUs to like 2400 - 2500Mhz. Regular MCM (Non monolithic) Ryzen can only max the Fabric at 1800 - 1900Mhz (2000Mhz if you have a golden chip).
Edit: Instead of sanding the CPU die when running direct die, I will be using some solder wick alloy (Liquid-metal like alloy that absorbs the indium solder on the die, no sanding needed).
If ur interested, I'll let ya know when I get the motherboard in and begin testing (I'll keep ya posted).
@@compuguy123 Sup. I just got a 5700G in my rig.
How th did you get an all core 4.6Ghz stable with only 1.25v Vcore?
My chip needs 1.35V for 4.4-4.5Ghz using PBO (not even all core) for stability with OCCT AVX and SSE. Any lower voltage results in a system restart.
If I disable all CPU cores but 2 I can run 4.6Ghz stable with 1.25V (haven’t tried lower).
Did you win big on the silicon lottery? Or did I just get super unlucky.
Edit: Did you run voltage / frequency tests before the delid? Is the delid what allowed you to run 4.6 all core stable?
Wow ! Can it run pbo via hydra at 5g 1.5v?
With PBO yeah but if you're running 1.5V it's going to degrade in months if not weeks. AMD silicon is weaksauce
does the temp drop by 15 degree ?
yes but make sure the lapping paper is super fine to finish and even to start; Use 3000 grit and then 6000 grit so that the liquid metal can stick to the surface properly
im thinking of doing my 5600x for gaming performance gains.
what was the lapping for ? sorry if its a silly question
Lapping was to make it more flat. For the 5600x you need to be very careful as it's a dual chiplet chip. You may need to preheat the chip to at least 100C and take extreme caution to avoid destroying the capacitors around the die.
@@compuguy123 yuh i read that its soldered . i may wait on delid and just lapp the ihs .
@@rl4416 I might give it a shot but it's certainly quite risky. Could take upwards of 2 hours to do
@@compuguy123 ty for replying.
@@rl4416 The issue is that the capacitor config is very close to the edge of the metal lid - which means moving more than 1mm could potentially catastrophically shear off most of the capacitors on the chip itself.
Thats waaaaay too much liquid metal on the die...Gamers Nexus, & others have routienly expressed that a little goes a long way.
True but also remember that the copper of the surface will absolutely eat through your liquid metal in a few months. The Indium will bond with the surface of the copper and seep deeper, so eventually it will harden. If you have slightly more it will prevent that from happening as easily or quickly.
I believe AMD CPU have a very good contact between IHS and die. Its unnecessary to do that.
anyway good work
That's true but this still drops it by quite a few degrees. Although going for the pure core speed here seems to have dropped the memory speed cap a little due to the lack of a massive EMI and cosmic ray shield.
The solder quality of AMD CPUs can be quite spotty. Despite lapping the IHS sometimes the ryzen 3600's and 5600g's can have high hotspots exceeding 10*C due to air pockets in the soldering.
Have you done this kind of thing for zen4? And if so what kind of cooler have you used (air/aio/custom water)?
There's too many chiplets and capacitors around the chip itself
*Edit: I'll delid one as soon as the prices come to reasonable levels
@@compuguy123 I see, was mainly asking because I am planning on doing that after getting inspired by a recent der8auer video and am looking for tips :D
You got a good chips
I just bought a used rig with a surprise delidded 5600g....stock Wraith cooler ...it hangs up on the socket and the mobo what a nightmare dude says 85* temps are okay I put on cinebench and has single cores up to 95* in under a minute...I don't even have the lid...I may just hack up the Wraith cooler. Who delids a soldered ihs only to put a stock cooler on-top?? smh
Lapping the die was a nice touch btw
What in the hell is that?!
These things run horribly without LM to act as a heatspreader. Its concentrated on the centre of the die.
You can get a nice AIO for it, just make sure to use LM and to sand down the AIO plate first, because 9/10 of them will use copper with enamel on it to stop rust.
@@compuguy123 I drove to get the ihs from the guy, lapped it real nice sandwiched it between a Wraith prism and the die with mx4... Found a 120mm mod to 3d print...doesn't get over 75c no matter what I throw at it...still can't believe the guy delidded this thing to begin with
@@compuguy123 I didn't have the budget for the AIO this was supposed to be a gift for my niece and nephew lol
@@itsmesomeguy lmao
the description looks like it was typed by r/ayymd
homie.. you gotta cut those nails :P
Do you have a video of clocking it to 4.6ghz on the a520
Isn't this the one? I don't think the cache is that stable when overclocked to 4.6GHz though. AMD cache game is pretty weak
@@compuguy123 don’t think you show how you did the overclock in bios or software I can only seem to find info on the a520 saying online can only overclock through the bclk?
Pretty cool, but definitely not worth it on these Ryzen 5 and 7.
Ow wow. I expected the iGPU to be a chiplet next to the 6 or 8 core CPU chiplet. But no it looks like just a regular monolithic die. This needs more investigation! Explains why the G CPU's only has half the cache! Even the 5700G got only half the cache of a 5600... 5600g for a Linux machine / media center is just killer. There are laptop grade G's out there that are also cool. But the 5600G is standard ATX. Got a 5600G and it is doing surprisingly great for a stopgap. Only complain I had was that Firefox ran really poorly on it but right before getting a 5800x3d or 5900x (not sure yet) all complains with the G is gone.
It is still not a beefy GPU but wow how far the 5600G can get me after Firefox started to behave. It really is only in games and Blender eevee viewport (walking around the scene) I notice slowdown. The CPU alone is really impressive. But the GPU even with questionable browser acceleration is just awesome. Most AM4 boards can slot in a 5600G and become a really good compact low noise machine. That was why I picked the 5600G since it is going to have a good life in a other system when I upgrade.
But with dedicated GPU a 5600 is probably a better pick. But 5600G was a really good GPU purchase a few months ago! Ha! Let us hope AM5 is going to bring more of this fantastic APU's! The fact that cable clutter is starting to take up more space then the hole computer is nuts. No need for PCIE when a APU can fool you into thinking your running a full tower PC.
It's basically a 3600X with a gpu slapped on it
It's completely monolithic, which also means that there are issues with the IO dropping out if the distance to core and power delivery lines are too small - hence why B550 has that many issues that AMD could not resolve despite 10 bios updates
Subbed
💀 la primera vez que veo a alguien lijando el socket. El metal liquido sólo debe aplicarse sólo cobre prácticamente 😳, apenas sobre zinc. Nunca aluminio
It's not aluminium, the heatsink is copper baseplate coated in nickel men
@@compuguy123 aún así al llevar nickel *creo que* deberías tener cuidado y echarle un ojo de vez en cuando
thats easily enough for 2 cpus potentialy 3 cpus of liquid metal not wise
Leave extra so it stays liquid for longer, but not too much that it starts to drip off the side of the cooler