Wicking works better with a higher iron tip temperature and way more flux. Most of the time it helps using a bigger tip for a higher thermal mass. Also, a pair of needle type probes will help you massively when doing those kinds of measurements on laptop boards.
Also if the board is soaking up some heat I also use hot air at the same time. It’s all a learning curve I’ve also only just started out. I’ve just reballed my 1st SoC and that was frustrating took many attempts lol.
Wicking works better with a higher iron tip temperature and way more flux. Most of the time it helps using a bigger tip for a higher thermal mass.
Also, a pair of needle type probes will help you massively when doing those kinds of measurements on laptop boards.
I usually cut off a small piece of wick probably around 10mm and then put a blob of solder on top so it flows towards the hot solder on the wick
Also if the board is soaking up some heat I also use hot air at the same time. It’s all a learning curve I’ve also only just started out. I’ve just reballed my 1st SoC and that was frustrating took many attempts lol.
Some pointier probes would help you a lot with this type of work