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Your words mean the world to me, Silicon Pioneer! Your kind feedback fuels our passion for exploring the world of CMP.

Thanks for your dedication to the channel, Silicon Pioneer! Spending a week per video and even reverse searching-wow, that's some next-level detective work! 🕵‍♂ The source you're looking for is C.A. Mack et al., “Modeling of solvent evaporation effects for hot plate baking of photoresist,” Proc. SPIE 2195, 584 (1994). But now I’m curious-why reverse search? Are you verifying, cross-referencing, or just unleashing your inner research ninja? Either way, it’s impressive!

@SemiSlides I mean the stuff you present is amazing, reverse search allows me to find nearby topics as well. Of course there will be something's you will miss given the length you can give to each topic , I want to go into more detail. I mean these are constraints you have with a TH-cam video.

I have also noticed that a lot of ur work in this video comes from principles of lithography haha, would appreciate if you add references in the future videos.

Thank you for your comment and for being such an awesome Silicon Pioneer! 🙌 Dry etching is an incredible topic, and I can already see your passion for it shining through! Right now, we’re fully immersed in CMP-think of it as polishing not just wafers but our knowledge, one layer at a time. 😄 You’re absolutely right that sharing knowledge helps deepen understanding-your expertise in dry etching could light up this community! Imagine the insights we could spark together. 🔥 Why not kick things off by sharing some of your experiences? Discussions like these often lead to "Eureka!" moments (like finding the perfect etch selectivity). While we haven’t decided on our next topic yet, rest assured it’ll be something that feels as neatly organized as a bookshelf in a cleanroom. Until then, your suggestions and enthusiasm keep us inspired. Let’s keep the conversation flowing! 🚀

Thank you for the kind words and for joining the Silicon Pioneers! 🙌 The short answer is, unfortunately, no. Here’s why: our channel focuses on the industry side of semiconductor technology, where the goal is less about theoretical modeling and more about sensing and controlling materials, equipment, and processes to consistently achieve high-quality production. While equations are vital for understanding the principles behind phenomena, in the industry, they often take a back seat to practical challenges like process stability and yield improvement. That said, if you’re looking to dive deeper into the theoretical side, tools like Google Scholar, university thesis, or even simulation software documentation are fantastic places to start. I’d likely turn to those same resources myself since I don’t keep any secret stash of equations in my back pocket (though I wish I did)! 😄 Keep asking great questions and exploring-your curiosity is what makes you a true Silicon Pioneer. 🚀

Everything is based on publicly available information. It's just that storytelling has been added. For those who want to know more, I have tried to leave as many references as possible, so please refer to them.

Oh my god, I expected so. Views might be low, but silicon’s got that glow- Like wafers we’re stacking, soon they’ll be cracking! Thanks for being a Silicon Pioneer, you know!

Congrats on landing the TSMC internship! 🎉 It’s incredible to hear how our deep dives-not scratch-level stuff, but the kind of knowledge even field engineers wrestle with-helped you stand out. Your curiosity and dedication truly paid off. Keep pushing forward-we’ve got more advanced content coming your way! 😉

Actually, I never left! Life just had me running a full production line. 😉 But it’s awesome to be back and reconnect with you all! Let’s keep the Silicon revolution going, Pioneer!

Hi there! Nice to meet you too! Thanks for the kind words-I'm thrilled you enjoyed the video and found it helpful. 😊 As much as I'd love to help, PowerPoint is like a stubborn old computer-it doesn’t support language translation. But here's the good news: TH-cam has some nifty features! It offers transcripts and translation options that might be just what your friend needs. Feel free to drop any questions here, and I'll be more than happy to dive deep into them or point you toward some great resources. Have a fantastic day, and happy learning to both you and your friend! 🚀✨

Great question! Actually, GAAFETs, just like their older siblings Planar Transistors and FinFETs, are already using High-k/Metal Gate (HKMG) technology instead of SiO2. The HKMG club is quite inclusive, you see! If SiO2 were still being used, it would feel like inviting a typewriter to a laptop convention. Thanks for watching, and keep those silicon inquiries coming! 😊🔬

Looks like our silicon wafers could give even the toughest Indian batters a run for their money! Just as resilient and ready to handle any fastball... or rather, fast electron. 🏏🔬

Oh, a classic camel ride does sound fun! But these days, AI voices are smoother and more comfortable than any bumpy camel ride. We're living in a time where distinguishing between human and AI voices is tough, so don't miss out on the perks of new technology! 😉🚀

That's fantastic news! I hope the interview went well. How did it turn out? We're all curious to know if you dazzled TSMC with your semiconductor savvy! Keep us posted, Silicon Pioneer! 🌟🚀

@@SemiSlides actually, it was pretty good and maybe you won't believe that but I got the job!

That's fantastic news! 🎉 Congrats on landing the job at TSMC! It’s amazing to hear that the content was helpful for your interview prep. I always strive to pack in as many useful tips and insights as possible, drawing from my own experiences as a job interviewer and those of others in the field. It’s awesome to know that it paid off for you. Welcome to the semiconductor world, Silicon Pioneer! 🚀 Keep pushing the boundaries of innovation! 🌟

congratulations!!!, what did you study and what languaje did you learn, also how did you get an interview. Its quite early for me i believe because im a student but i want to prepare a lot to get there.

@@rojasgonzales8210 Thank you so much! I have studied photolithography in detail through TH-cam channels and academic papers. However, I had the opportunity to conduct hands on experiments on photolithography during my PhD at the University of New Mexico :) Still, I applied many jobs that are close to my skills. After getting accepted, I started to study Chinese :) I believe you are a successful student and for preparation I can say that "the earlier the better"...

Thank you for the great feedback and for watching the video! Regarding your question about the ASML Orion system and the use of Intel's alignment marks, that's a great query. However, our channel doesn't disclose any information that could infringe on a company's confidential details or trade secrets. In general, ASML systems are designed to be quite versatile, but specific implementations involving proprietary designs like Intel's alignment marks would fall into the category of confidential information. Thanks for understanding, and keep exploring the fascinating world of semiconductors! 😊

@@SemiSlides also curious what is the difference between alignment mark and overlay mark? in terms of functionality

Hey there, Silicon Pioneer! Great question! Let's dive into the differences between alignment marks and overlay marks from a functionality perspective, especially in the context of ASML Twinscan systems. Alignment Marks: These are used to align the reticle (the photomask) with the wafer. Given that photolithography equipment is expensive, maintaining continuous operation on the exposure side is the top priority. Therefore, the alignment measurement on the measure side must be completed in less time than it takes for the exposure side to process a single wafer. This means the system can't align every single field on the wafer individually. Instead, it focuses on aligning the entire wafer with the entire reticle to keep things running smoothly and efficiently. Overlay Marks: These come into play after the exposure and, unlike alignment marks, the process doesn't affect the expensive ASML system's productivity. As a result, a separate overlay measurement system can be used to thoroughly and massively measure the overlay for each individual exposure field. This helps identify any misalignment across all the exposure fields and provides detailed feedback to ensure better alignment for future exposures. And hey, apologies for the delay in getting back to you. Sometimes, the notification system likes to take its sweet time. Thanks for your patience! Keep those awesome questions coming! Cheers, Semi Sherpa 🌟

Thank you so much for your kind words! We're thrilled to hear that you find our channel to be the best on TH-cam for lithography themes. Your support means a lot to us. And don't worry, we'll keep this secret about our channel being the best from Professor Chris Mack over at the Litho Guru channel! We're currently working on content about CMP, but we'd love to know if there are specific aspects of lithography you're interested in learning more about. Thanks again for subscribing and for your enthusiasm. Stay tuned for more amazing content!

​@@SemiSlidesHaha, I think Mr. Mack deserves to know how good he is at explaining this things! Tell him about my comment 😂. And about your question: There are a lot of videos around this theme here on YT, but all the contents are just "the same"... your channel goes deep on the "technical thing", and this is what makes you different from the others. Keep going on this way, the internet is already full of generic information, but your content is rich! Thank you for sharing your experience with us 🙏.

Thanks for the intriguing question! Here’s my take: 1. Low EUV Reflectivity: Single-layer diamond films don't offer high reflectivity for EUV wavelengths. Effective EUV mirrors require multilayer coatings, like Mo/Si Bragg mirrors. 2. Material Comparison: Diamond doesn’t provide significant advantages over Mo/Si multilayers. At EUV wavelengths, diamond and graphite offer similar atomic properties, making their unique bonding structures less impactful. 3. Manufacturing Challenges: Diamond substrates are difficult to process with techniques like ion milling, limiting their practical application. 4. Hydrogen Environment Issue: In EUV systems, hydrogen environments used to manage tin debris can cause diamond to convert to hydrocarbons, further complicating its use. I appreciate the great question. For a broader perspective, consider discussing this on a forum with a larger audience. Keep those brilliant questions coming, Silicon Pioneer!

Thank you so much for your generous $10 Super Thanks! We truly appreciate your support. Regarding the content on masks, it’s based on real-world semiconductor production practices. We incorporate insights from experts with over 20 years of experience in the field, ensuring that our information is both accurate and highly relevant. Your engagement and support help us continue to share this valuable knowledge.

Regarding the thickness of the Mo/Si mirror, please refer to EUVL Part 3. th-cam.com/video/Sx41pOBUu1I/w-d-xo.html