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Everything is based on publicly available information. It's just that storytelling has been added. For those who want to know more, I have tried to leave as many references as possible, so please refer to them.

Oh my god, I expected so. Views might be low, but silicon’s got that glow- Like wafers we’re stacking, soon they’ll be cracking! Thanks for being a Silicon Pioneer, you know!

Congrats on landing the TSMC internship! 🎉 It’s incredible to hear how our deep dives-not scratch-level stuff, but the kind of knowledge even field engineers wrestle with-helped you stand out. Your curiosity and dedication truly paid off. Keep pushing forward-we’ve got more advanced content coming your way! 😉

Actually, I never left! Life just had me running a full production line. 😉 But it’s awesome to be back and reconnect with you all! Let’s keep the Silicon revolution going, Pioneer!

Hi there! Nice to meet you too! Thanks for the kind words-I'm thrilled you enjoyed the video and found it helpful. 😊 As much as I'd love to help, PowerPoint is like a stubborn old computer-it doesn’t support language translation. But here's the good news: TH-cam has some nifty features! It offers transcripts and translation options that might be just what your friend needs. Feel free to drop any questions here, and I'll be more than happy to dive deep into them or point you toward some great resources. Have a fantastic day, and happy learning to both you and your friend! 🚀✨

Great question! Actually, GAAFETs, just like their older siblings Planar Transistors and FinFETs, are already using High-k/Metal Gate (HKMG) technology instead of SiO2. The HKMG club is quite inclusive, you see! If SiO2 were still being used, it would feel like inviting a typewriter to a laptop convention. Thanks for watching, and keep those silicon inquiries coming! 😊🔬

Looks like our silicon wafers could give even the toughest Indian batters a run for their money! Just as resilient and ready to handle any fastball... or rather, fast electron. 🏏🔬

Oh, a classic camel ride does sound fun! But these days, AI voices are smoother and more comfortable than any bumpy camel ride. We're living in a time where distinguishing between human and AI voices is tough, so don't miss out on the perks of new technology! 😉🚀

That's fantastic news! I hope the interview went well. How did it turn out? We're all curious to know if you dazzled TSMC with your semiconductor savvy! Keep us posted, Silicon Pioneer! 🌟🚀

@@SemiSlides actually, it was pretty good and maybe you won't believe that but I got the job!

That's fantastic news! 🎉 Congrats on landing the job at TSMC! It’s amazing to hear that the content was helpful for your interview prep. I always strive to pack in as many useful tips and insights as possible, drawing from my own experiences as a job interviewer and those of others in the field. It’s awesome to know that it paid off for you. Welcome to the semiconductor world, Silicon Pioneer! 🚀 Keep pushing the boundaries of innovation! 🌟

congratulations!!!, what did you study and what languaje did you learn, also how did you get an interview. Its quite early for me i believe because im a student but i want to prepare a lot to get there.

@@rojasgonzales8210 Thank you so much! I have studied photolithography in detail through TH-cam channels and academic papers. However, I had the opportunity to conduct hands on experiments on photolithography during my PhD at the University of New Mexico :) Still, I applied many jobs that are close to my skills. After getting accepted, I started to study Chinese :) I believe you are a successful student and for preparation I can say that "the earlier the better"...

Thank you for the great feedback and for watching the video! Regarding your question about the ASML Orion system and the use of Intel's alignment marks, that's a great query. However, our channel doesn't disclose any information that could infringe on a company's confidential details or trade secrets. In general, ASML systems are designed to be quite versatile, but specific implementations involving proprietary designs like Intel's alignment marks would fall into the category of confidential information. Thanks for understanding, and keep exploring the fascinating world of semiconductors! 😊

@@SemiSlides also curious what is the difference between alignment mark and overlay mark? in terms of functionality

Hey there, Silicon Pioneer! Great question! Let's dive into the differences between alignment marks and overlay marks from a functionality perspective, especially in the context of ASML Twinscan systems. Alignment Marks: These are used to align the reticle (the photomask) with the wafer. Given that photolithography equipment is expensive, maintaining continuous operation on the exposure side is the top priority. Therefore, the alignment measurement on the measure side must be completed in less time than it takes for the exposure side to process a single wafer. This means the system can't align every single field on the wafer individually. Instead, it focuses on aligning the entire wafer with the entire reticle to keep things running smoothly and efficiently. Overlay Marks: These come into play after the exposure and, unlike alignment marks, the process doesn't affect the expensive ASML system's productivity. As a result, a separate overlay measurement system can be used to thoroughly and massively measure the overlay for each individual exposure field. This helps identify any misalignment across all the exposure fields and provides detailed feedback to ensure better alignment for future exposures. And hey, apologies for the delay in getting back to you. Sometimes, the notification system likes to take its sweet time. Thanks for your patience! Keep those awesome questions coming! Cheers, Semi Sherpa 🌟

Thank you so much for your kind words! We're thrilled to hear that you find our channel to be the best on TH-cam for lithography themes. Your support means a lot to us. And don't worry, we'll keep this secret about our channel being the best from Professor Chris Mack over at the Litho Guru channel! We're currently working on content about CMP, but we'd love to know if there are specific aspects of lithography you're interested in learning more about. Thanks again for subscribing and for your enthusiasm. Stay tuned for more amazing content!

​@@SemiSlidesHaha, I think Mr. Mack deserves to know how good he is at explaining this things! Tell him about my comment 😂. And about your question: There are a lot of videos around this theme here on YT, but all the contents are just "the same"... your channel goes deep on the "technical thing", and this is what makes you different from the others. Keep going on this way, the internet is already full of generic information, but your content is rich! Thank you for sharing your experience with us 🙏.

Thanks for the intriguing question! Here’s my take: 1. Low EUV Reflectivity: Single-layer diamond films don't offer high reflectivity for EUV wavelengths. Effective EUV mirrors require multilayer coatings, like Mo/Si Bragg mirrors. 2. Material Comparison: Diamond doesn’t provide significant advantages over Mo/Si multilayers. At EUV wavelengths, diamond and graphite offer similar atomic properties, making their unique bonding structures less impactful. 3. Manufacturing Challenges: Diamond substrates are difficult to process with techniques like ion milling, limiting their practical application. 4. Hydrogen Environment Issue: In EUV systems, hydrogen environments used to manage tin debris can cause diamond to convert to hydrocarbons, further complicating its use. I appreciate the great question. For a broader perspective, consider discussing this on a forum with a larger audience. Keep those brilliant questions coming, Silicon Pioneer!

Thank you so much for your generous $10 Super Thanks! We truly appreciate your support. Regarding the content on masks, it’s based on real-world semiconductor production practices. We incorporate insights from experts with over 20 years of experience in the field, ensuring that our information is both accurate and highly relevant. Your engagement and support help us continue to share this valuable knowledge.

Regarding the thickness of the Mo/Si mirror, please refer to EUVL Part 3. th-cam.com/video/Sx41pOBUu1I/w-d-xo.html

Absolutely, thanks for pointing that out! 🌟 Including the slides link in the description is a fantastic suggestion for those who want to explore deeper. Also, using the ChatGPT Chrome extension to get summaries is super clever! For an enhanced learning experience, check out the extension here: chromewebstore.google.com/detail/youtube-summary-with-chat/nmmicjeknamkfloonkhhcjmomieiodli Keep those brilliant ideas coming, Silicon Pioneers! 😎👍

@@SemiSlides FROM MY EXPERIENCEAND I KNOW MANY OF THE VIEWERS FIRST EXPLORE THE SLIDES TO HAVE A GRASP IN THE CONTENT IN MINUTES. AND IF THEY FIND THE CONTENT RELEVANT TO THEIR REQUIREMENT THEY WILL SPEND THEIR TIME BY THOROUGHLY VIEWING IT. THE ATTENTION SPAN OF EVERY LEARNER IS CONTINUOUSLY DROPPING. IT IS TRUE FOR ME ALSO. THANKS FOR RESPONDING SO FAST. WAITING FOR THE LINKS TO APPEAR IN YOUR ALL VIDEOS. SOON. THANKS FOR REFERRING THE CHROME EXTENSION. I WILL DEFINITELY GIVE IT A TRY THANKS AGAIN. N.B. - I HAVE MAILED YOU ALSO.

We're thrilled you think so! Our team put in many 'nanoseconds' of effort to ensure each slide was 'positively charged' with info. Thanks for tuning in, and stay 'current' with us for more electrifying content! ⚡😊

Absolutely, you've nailed a key point! Reticle defects, especially haze, are well-known in the semiconductor realm. Thanks to their consistent replication on each shot, these defects are predictable and manageable. Periodic cleaning and sophisticated detection systems are standard practices now, efficiently preventing and spotting haze defects early. It’s like having a high-tech security system for pristine reticle maintenance! Keep the great questions coming as we delve deeper into semiconductor intricacies! 🌟🔍

Caught in the whirlwind of life, finding time for content creation has been tougher than achieving the perfect photolithography pattern on a busy day in the fab. My schedule's as packed as a high-density chip, but I'm etching out moments for our channel. Your support means the world, akin to flawless wafer yields. Hang tight, Silicon Pioneers, and thanks for sticking with me through thick and thin films!

Hey @schlawuzieohnename3090, Big thanks for the shout-out! 🚀 Your support is like doping in semiconductors-vital and energizing! Now, onto the biz. My semiconductor journey's been a bit like a high-k dielectric layer-pretty dense. With books, papers, patents, and teaching gigs under my belt, I’m more about sharing the volts and jolts of knowledge than collecting more accolades or queries. This channel? It's my way of throwing open the lab doors-digitally, at least-to offer top-notch semiconductor smarts for free. Think of it as an all-you-can-learn buffet, no reservations required. 🍽 Got a burning question or a curiosity spark? Drop it right here! I’m always around, ready to sprinkle some wisdom or just a good ol' chuckle. As for emails, let's just say my inbox is like a quantum well-best not to add more electrons to it unless absolutely necessary. Keep those neurons firing and circuits wiring, Silicon Pioneers! Cheers, Semi Sherpa from the SemiSlides Squad 🌟

Thank you very much for your friendly feedback! You are doing a really great job!!! I am the head of department at a non-commercial educational institution for micro and nanotechnologies and we work (day and night) with enthusiasm and with many companies and institutes in Germany to make great progress in vocational training in technology. You people are urgently needed :) So I am very happy to have discovered your exciting channel - a great asset!!! Thank you very much again!

Absolutely, we're gearing up to dive into the world of advanced packaging, and your enthusiasm is the icing on our semiconductor cake! Think of us as master bakers in the grand kitchen of semiconductor technology. Right now, we're meticulously gathering all the ingredients - knowledge, tech insights, and a sprinkle of Silicon Pioneer curiosity. Our oven, metaphorically speaking, is preheating. While I can't exactly tell you when this delicious cookie will be ready to serve, rest assured, it's going to be one tasty treat, blending the finest chips with the most exquisite packaging techniques. So, keep your napkin close and your appetite for knowledge even closer. We're cooking up something that's not just cool; it's sub-zero! Stay tuned, and thanks for stirring up such a great question!

Ah, the age-old quest for a summary! While I'd love to condense the wisdom of the ages (or at least the wisdom of a few minutes of video) into a bite-sized treat for you, I must confess, my summarizing quill has temporarily run out of ink. My scribe duties are on a brief hiatus, as I'm currently enrolled in the 'Art of Elaboration'. But fear not, for the adventure of watching the video may yet reveal untold treasures. Who knows what enlightening secrets you'll uncover on this quest? 🧙‍♂️✨

I think he was asking for the slides. This is the short version it is 3 decades of resist evolution in a short video.

Thank you for your insightful question. I apologize for any confusion caused by the slide presentation. The images attached to the slide are indeed stitched together from different sources and not from the same paper, which might have led to some misunderstanding. To clarify, the terms Heavy Hole (HH) and Light Hole (LH) are indeed based on the no strain condition of the semiconductor material. It's correct that the effective mass of HH is higher, which typically results in lower mobility compared to LH under no strain conditions. However, when tensile strain is applied, the situation can change significantly. The impact of tensile strain on the band structure and, consequently, on the mobility of carriers (holes in this case) is complex and depends on several factors, including the direction of the strain and the specific channel material being used. Tensile strain can alter the energy levels of HH and LH, as well as their effective masses, which in turn affects their mobility. In some cases, tensile strain can indeed enhance the mobility of HH or make the mobility differences between HH and LH less pronounced, depending on how the strain modifies the band structure. It's important to note that the effects of strain on energy levels and mobility are highly dependent on the material properties and the strain's directionality. This means that the specific outcomes can vary widely across different semiconductor materials and strain configurations. Again, I appreciate your question, and I hope this explanation helps to clarify the situation. The interplay between strain, energy levels, and mobility is a nuanced topic that highlights the complexity of semiconductor physics and the importance of considering all factors in device design and analysis.

Ah, the secrets of the semiconductor world are much like a complex integrated circuit - layered, intricate, and occasionally, shrouded in the mystique of pure silicon magic! 🌌 My journey through the valleys and peaks of silicon has been fueled by an insatiable curiosity and, admittedly, an unhealthy amount of caffeine. ☕️ Each transistor gate I've crossed and every silicon wafer I've encountered has been a story, a lesson in the vast encyclopedia of semiconductor knowledge. Sharing this knowledge with you, my fellow Silicon Pioneer, is what powers my circuits! And remember, if you ever feel the urge to support this channel in a tangible way, Superthanks is always there, like a trusty old EEPROM, retaining your generosity even when the power is off. Here's to navigating the semiconductor landscape together, armed with humor, wisdom, and perhaps a semiconductor joke or two. May our paths be as conductive as a well-doped silicon substrate! ⚡️

In the realm of memory technologies, the term "erase" is often associated with the process required in Flash memory, where it signifies a prelude to data writing. This step involves resetting a significant portion of the memory to a default state, typically turning all bits to 1, making it ready for new data to be written. This process is distinct and necessary due to the physical and operational characteristics of Flash memory. Contrastingly, SRAM operates without a conventional erase step. Data in SRAM is stored using flip-flop circuits for each bit, enabling direct state changes from 0 to 1 or vice versa, allowing for the immediate overwrite of existing data. However, the introduction of processes like bitline equalization into this discussion illuminates a critical aspect of SRAM's data writing mechanism. Bitline equalization can be seen as a phase of preparing the memory cells for new data by setting the bitlines to a known, neutral state. This step, integral to SRAM's operation, ensures a stable and efficient environment for the incoming data, optimizing the memory's performance by minimizing write operation times and enhancing reliability. Though not an "erase" in the traditional sense, especially not in the way it is understood within Flash memory technology, bitline equalization serves a preparatory function that could be likened to erasing, in that it readies the cell for new information by neutralizing previous states. Therefore, while SRAM inherently does not require an erase phase before writing new data, it involves preparatory actions such as bitline equalization. These actions, essential for the direct overwrite capability, ensure that SRAM cells are in an optimal state for new data. This perspective broadens the understanding of "erasing" beyond its conventional boundaries, highlighting the diverse approaches different memory technologies use to manage and update data. In essence, SRAM's design and operation circumvent the need for a traditional erase before writing new data but include essential steps to ensure the memory is primed for data modification. This nuanced understanding aligns with the broader mechanics of memory technologies, where various processes ensure efficient and reliable data storage and retrieval.

The design file, particularly in formats like GDSII or OASIS, plays a crucial role in the semiconductor manufacturing process, especially when it comes to multipatterning techniques. These files are primarily intended to provide the layout for mask writers, ultimately aiming to decompose the target layout into a form that corresponds to a single mask layout. This decomposition is essential because, in the context of multipatterning, the target layout layer is intricately divided, or decomposed, into multipatterning-related layers to achieve the desired resolution and pattern density on the semiconductor wafer. To directly address your query, the design file does indeed include both the target layout layers and all the multipatterning-related layers. This is a critical aspect of modern semiconductor fabrication, where multipatterning techniques are employed to overcome the limitations of photolithography by enabling finer feature sizes and greater pattern densities than would be possible with a single patterning process. The process of decomposing the target layout into multipatterning-related layers is a sophisticated task. It involves deciding whether to split the target layout into two colors (as in double patterning), three colors, or to use techniques like Self-Aligned Double Patterning (SADP) among others. This decomposition is guided by advanced software tools provided by companies like Synopsys. These tools analyze the target layout and determine the most efficient way to decompose it into multiple patterns that can be individually processed and later merged to form the final, complex structures on the wafer. This decomposition is not arbitrary but is a highly technical decision-making process that takes into account the limitations of the photolithography equipment, the physical and chemical properties of the materials involved, and the ultimate goals of the semiconductor device being manufactured. By employing such advanced decomposition strategies, manufacturers can ensure that the final mask layout, as represented in the GDSII or OASIS file, accurately reflects the multipatterned design necessary for fabricating advanced semiconductor devices. For those seeking a deeper dive into the specifics of double patterning and its role in semiconductor fabrication, "Design Rules in a Semiconductor Foundry" by Eitan N. Shauly, published in 2022, is an invaluable resource. Particularly, the discussion on double patterning found between pages 42 and 68 offers detailed insights into how target layouts are decomposed into multipatterning-related layers, highlighting the critical role of software tools in this process. This book section is recommended for anyone looking to understand the intricacies of multipatterning and its impact on the design and fabrication of semiconductor devices.

Thanks ​@@SemiSlides

We're diving into the world of Chemical Mechanical Planarization (CMP) for our next series, shining a light on the semiconductor industry's unsung hero. Picture CMP as a spa day for semiconductors, buffing chips to high-performance perfection. As we gather insights and polish our content to a wafer-like sheen, we'll need a brief pause in our uploads, expecting a few months' hiatus. Thanks for your patience! Prepare for a blend of tech insights sprinkled with humor that makes CMP as engaging as your morning coffee. Stay tuned for a series where science meets wit!