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Shouldn’t the NVME face the other way? You are putting 2 heat generating components in the same stack
They are in the same region so the traces between them are short for high speed data transfer. They face opposite directions so that the CPU can be thermally coupled to the enclosure top while the name is thermally coupled to the enclosure bottom
Shouldn’t the NVME face the other way? You are putting 2 heat generating components in the same stack
They are in the same region so the traces between them are short for high speed data transfer. They face opposite directions so that the CPU can be thermally coupled to the enclosure top while the name is thermally coupled to the enclosure bottom