Discover: die-to-wafer hybrid bonding | CEA-Leti
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- เผยแพร่เมื่อ 21 ส.ค. 2023
- Discover CEA-Leti expertise in terms of hybrid bonding: the different stages of die-to-wafer process in CEA-Leti clean room, starting with Chemical Mechanical Planarization (CMP), through die-to-wafer bonding, alignment measurement, characterization of bonding quality and grinding.
#HybridBonding #3D #packaging
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This impressivley show the spirit and creativity of the semiconductor industry.
非常漂亮的制程展示,谢谢。
❤
What can you say about durability, long lifespan of Power Management IC units in chiplets
What we will see in 2027 in term of implementation 2nm chiplet packaging in consumer gadgets.
u'll im problem plz complete!
Very cool!