I recommend you to reflow the board again with some good old hand soldering flux like felder lötfett or something similiar, a rosin flux that is of good quality. Such fluxes work wonders for solder meniscus forming and I'm pretty sure it will align the components at the dead center. Those newer high tech fluxes never worked good enough for me, maybe I don't have the good ones.
Regarding your remark that there was too much solder paste deposited: maybe it's possible to have the stencil manufactured from a thinner plate. A thinner plate will allow for less solder paste to be deposited in the stencil cutouts. Alternatively, stencil cutouts smaller in size than the footprint could maybe work as well - the solder paste flux will take care of completely wetting /distributing the solder across the footprint during reflow.
Brandon, I enjoyed your video. I received a "UYUE 946-1010" hotplate today, so I've been scouring TH-cam looking at how other people are using hotplates. I reflowed a small board and worked well. To reduce the amount of paste use a stiff plastic card. Also, you can press the components down into the paste when you place them. Using a proper hotplate will allow you to mess about with the speed it heats up, and reflows - that probably has a bearing on the way things solder too. If yours takes too long to heat up on the stove then the effectiveness of the flux may be gone by the time the solder melts. Just my thoughts of "day one" of hotplate reflow soldering. I look forward to more videos.
I recommend you to reflow the board again with some good old hand soldering flux like felder lötfett or something similiar, a rosin flux that is of good quality. Such fluxes work wonders for solder meniscus forming and I'm pretty sure it will align the components at the dead center. Those newer high tech fluxes never worked good enough for me, maybe I don't have the good ones.
Regarding your remark that there was too much solder paste deposited: maybe it's possible to have the stencil manufactured from a thinner plate. A thinner plate will allow for less solder paste to be deposited in the stencil cutouts.
Alternatively, stencil cutouts smaller in size than the footprint could maybe work as well - the solder paste flux will take care of completely wetting /distributing the solder across the footprint during reflow.
Brandon, I enjoyed your video. I received a "UYUE 946-1010" hotplate today, so I've been scouring TH-cam looking at how other people are using hotplates. I reflowed a small board and worked well. To reduce the amount of paste use a stiff plastic card. Also, you can press the components down into the paste when you place them. Using a proper hotplate will allow you to mess about with the speed it heats up, and reflows - that probably has a bearing on the way things solder too. If yours takes too long to heat up on the stove then the effectiveness of the flux may be gone by the time the solder melts. Just my thoughts of "day one" of hotplate reflow soldering. I look forward to more videos.
Thanks for the shout-out 😄
use a credit card to spread the paste, or maybe your membership card at your local video rental place...
Generally incompetent 😂