i would say putting the void under the switch node will likely to create more EMI issues because i consider the switch node as a high speed digital signal. Any thoughts?
Assuming a 2-layer board, hence if the area is void, there would be no or minimum coupling because a capacitor is formed by 2 conductors and an internal dielectric. Having a void means you don't have the needed plane/conductor to create a parasitic capacitor
Where’s the ground plane? Every trace should be one dielectric distance from an uninterrupted return reference. I don’t understand converter data sheets that show ground pours on the top when layer 2 should be a solid ground plane.
i would say putting the void under the switch node will likely to create more EMI issues because i consider the switch node as a high speed digital signal. Any thoughts?
Assuming a 2-layer board, hence if the area is void, there would be no or minimum coupling because a capacitor is formed by 2 conductors and an internal dielectric. Having a void means you don't have the needed plane/conductor to create a parasitic capacitor
Where’s the ground plane? Every trace should be one dielectric distance from an uninterrupted return reference. I don’t understand converter data sheets that show ground pours on the top when layer 2 should be a solid ground plane.
This isn’t a UHF transmitter.