Using AI To Close Coverage Gaps

Verification of complex, heterogeneous chips is becoming much more difficult and time-consuming. There are more corner cases, and devices have to last longer and behave according to spec throughout their lifetimes. This is where AI fits in. It can help identify redundancy and provide information about why a particular device or block may not be able to be fully covered, and it can do it in less time than relying on traditional methods, which are time-consuming. Will Chen, principal applications engineer for platform operations and validation in Synopsys’ EDA Group, talks with Semiconductor Engineering about what's behind these changes and where AI works best.