Advancement in 2.5D and 3D Semiconductor Packaging Technologies

In this webinar, Senior Technology Analyst Dr. Yu-Han Chang presents IDTechEx's latest research findings for the advanced semiconductor packaging industry, which will include research from IDTechEx's new market research report: "Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications" - www.IDTechEx.com/ASP
This webinar will reveal insights into 2.5D and 3D advanced semiconductor packaging technologies. The content includes:
- 2.5D advanced semiconductor packaging technologies: current status, existing barriers, future development trend, target markets, player analysis
- 3D advanced semiconductor packaging technologies: current status, existing barriers, future development trend, target markets, player analysis
- Market outlook for 2.5D and 3D packaging technologies
For copies of the slides presented here, please email [e-mail].