FEI Helios G4 PFIB CXe dual beam FIB/SEM: TEM lamella prep tutorial
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- เผยแพร่เมื่อ 2 ต.ค. 2024
- In this video tutorial (as always filmed raw, unedited, uncut, and unfiltered), I demonstrate use of our FEI Helios G4 PFIB CXe dual beam FIB/SEM for TEM lamella prep using a Si test specimen. In particular, I emphasize differences between lamella prep with a Ga FIB as compared to a Xe FIB (PFIB).
Thanks for watching! Please like, subscribe, and share and let me know if you have any questions or comments. Video topic requests are always welcome and appreciated; I enjoy making these videos and wish I could make them more frequently, but the demands of my job make it tough to do so; I’m in charge of 3 S/TEMs, 2 dual beam FIB/SEM systems, and 1 SEM and this keeps me very busy!
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E-mail me directly:
ngr@ufl.edu
thank you for the video. it help me a lot!
You're welcome; always glad to hear my video was helpful to you.
Great video! I am very grateful that you take such a time to teach us all these things. Great job!!
Do you have the same one but with gallium? I am working with a Helios Nanolab600 dual beam and it would be very useful (at least for me 😄) to know better how to prepare TEM lamellas. I'm really not very skilled at that.
I've read that you were thinking of it or preparing a video about it, but I was not able to find it on your channel. Thanks a lot in advance.
Hi Manu: glad to hear you found the video helpful. Yes, I have a video for lamella prep with a Ga FIB (Helios Nanolab 600i); please see here:
th-cam.com/video/M46Ol4gltbI/w-d-xo.html
I didn't record it using the same high tech screen capture method like I did with the PFIB lamella prep video, but hopefully it will still suffice.
Thank you, Nick! Very helpful!!!
You're welcome; glad to hear you found it helpful!
FIB Milling pattern x,y,z 중 z 정의를 알려줄수있나요.
thank you very much,Very helpful!!!
You're welcome; thanks for watching!
Thank you Nick, this is supper helpful. Was wondering if you could make a video about plane cut.
You're welcome; doing plan-view lamella prep is far more difficult compared to cross-sectional, which I do in this video. There are a couple published papers presenting methods for doing this, but from what I recall, it was very complicated. Please send me an email directly and I will send you copies of these papers.
Hi Nick, It's a very fantastic video, really like it. I have one question: for the last milling process with 5kV or 2kV, will a longer time be better? Does it have any side effects?
Thank you; I deleted the previous comment because I wrote it thinking your question was in reference to the Ga FIB, but this is actually about the PFIB. In general, I don't bother using 2 kV with the PFIB. The reason for this is that the curtaining of the sidewalls at 2 kV with the PFIB is very bad and the difference in damage layer thickness between 5 and 2 kV isn't that substantial for PFIB, so I just avoid 2 kV. Thanks for your support and I hope this helps.
why do we cut at 47 and 57 degree after the Pt deposition? I was got taught by to cut this step at 52 degree. Is there any benefit for this?
This is called over and under tilting, and yes, it does have two main benefits. The first is that it tapers the lamella down thinner near the bottom, which makes it easier to perform the undercut (or "J" cut). The second reason is that it helps to preserve the Pt strap so it is more intact during later final thinning. Regarding the second point, I find that doing this over/under tilting is particularly critical with PFIB due to the larger PFIB beam sizes (compared to Ga FIB) because otherwise it is very easy to accidentally mill away the Pt strap before you ever get to the final thinning part (which you definitely want to avoid). That being said, even with Ga FIB, I still opt to employ the same amount of over/under tilting, just to be safe. Thanks for watching the video and I hope this helps.
@@NicholasRudawski thanks for letting me know! U also explain things really detailed, whenever there is a question posted here
@@92104000b You're welcome; glad to know I was able to help you out.
@@NicholasRudawski谢谢你让我学到很多
@@zec5115 Thank you and glad to hear you are learning something from my videos.
you mentioned in the video that we could do a post cleaning step after j cut. what is it for? How to do it? what is the setting for doing this step? what will the sample looks like after cleaning step?
It's nothing special; it's just a cleaning cross-section on the top side of the lamella (in the FIB image with 180 degree scan rotation) after doing the J cut. This just evens this side of the lamella out so it is nice an flat. I would do this at 4 nA, the same setting i used for doing the J cut and also with 5 degrees of over-tilt (like what was used previously for the trenches and rough cleaning). Thanks for your question and I hope this helps.
Most of the time I lose the pt layer on top 😢
Yes, this can be very frustrating as I have experienced this myself, too. At what stage are you losing it? Is it during final thinning or is it before that? The main way to address this is to makes sure you use sufficiently high over and under-tilts when patterning and to not be too aggressive with your pattern placement. I also tend to opt for a much thicker Pt layer in PFIB compared to Ga FIB.
Hi Nicolas. Great video. Can you show a tutorial on STEM imaging ?
Thank you, Nash; I have lots of videos on my channel about performing STEM imaging! Please take a look through my uploads when you have a chance.
@@NicholasRudawski Hi nicholas I meant stem imaging using the FIB ?
@@nash1725ah, got it; yes, I can't really do this on any of my systems as none of them have any STEM detectors. There are some fancy (and expensive) holders you can purchase to convert your ETD into a STEM detector, but I don't have any of these either. I'll see what I can do but I'm unfortunately rather limited here by my instrumentation here.