Surface Metrology for Advanced Packaging - FRT, a FormFactor Company

Microscopic features such as TSVs, microbumps and trenches incorporated into advanced semiconductor packages have enabled ICs that are smaller and faster than ever. But they’ve also introduced new challenges for manufacturers, to fabricate these features at new levels of precision. Fortunately, sophisticated multi-sensor tools such as 3D surface metrology and defect inspection from FRT (a FormFactor company) can help manufacturers to make the “invisible” visible, and precisely measure these tiny features.
#AdvancedSemiconductorPackages #SurfaceMetrology
Learn more about us: frtmetrology.c...
Follow FormFactor -
Facebook: / formfactorinc
LinkedIn: / formfactor