When PCB trace is imported as 2D shell and modal analysis is performed for 4 holes edges as fixed boundary conditions and again same pcb is modelled as 3D with all layers and same boundary conditions is assigned why 2d shell results show higher frequency values??
I have a small doubt. We are performing trace mapping in 2D (shells), Why should we give vias input, in via worksheet In the end we need only the material properties along x,y directions right? Since the trace mapping is done on shells?
I have a similar question too. When we model the PCB layers as 2D shells and then specify the thickness, does it allow us to simulate bending in out of plane direction as well?
When PCB trace is imported as 2D shell and modal analysis is performed for 4 holes edges as fixed boundary conditions and again same pcb is modelled as 3D with all layers and same boundary conditions is assigned why 2d shell results show higher frequency values??
Is there a way to set up the trace map within Ansys? It seems like the original ECAD file must contain the layer stack-up information...
How to do modal analysis of PCB after trace mapping ???
Actual PCB thickness will be assigned or layer by layer thickness need to be assigned?
How did you view results by layer? I don't have a "Layer" option for stress or strain. I can only view results by top, bottom, middle, and top/bottom.
I have a small doubt. We are performing trace mapping in 2D (shells), Why should we give vias input, in via worksheet
In the end we need only the material properties along x,y directions right? Since the trace mapping is done on shells?
I have a similar question too. When we model the PCB layers as 2D shells and then specify the thickness, does it allow us to simulate bending in out of plane direction as well?