Great webinar Iain! 1:04:10 Yes, PLECS Thermal domain simulation can account for thermal impedances. The semiconductor device’s junction-to-case thermal impedance is defined as Cauer/Foster thermal chain data inside each device thermal description, which is usually provided directly by manufacturers. And the cooling system heatsink-to-ambient thermal impedance can be modeled using PLECS library > Thermal > Components > Thermal Chain, or Thermal Resistor with Thermal Capacitor connected to a Heat Sink component.
Thanks for your great feedback. Indeed, the device thermal description models inside PLECs are very useful indeed and something we use to examine transient thermal behaviour during peak load conditions. It is so useful to have this sort of advanced modelling capability available to us.
Great webinar Iain! 1:04:10 Yes, PLECS Thermal domain simulation can account for thermal impedances. The semiconductor device’s junction-to-case thermal impedance is defined as Cauer/Foster thermal chain data inside each device thermal description, which is usually provided directly by manufacturers. And the cooling system heatsink-to-ambient thermal impedance can be modeled using PLECS library > Thermal > Components > Thermal Chain, or Thermal Resistor with Thermal Capacitor connected to a Heat Sink component.
Thanks for your great feedback. Indeed, the device thermal description models inside PLECs are very useful indeed and something we use to examine transient thermal behaviour during peak load conditions. It is so useful to have this sort of advanced modelling capability available to us.
Thank you for sharing.
The University of Berkeley, not Barkley ;)
Thanks Brian, I have been experimenting with auto captions for these videos and results aren’t that great…