Why are AMD AND INTEL using CHIPLETS (Tiles)??

Intel recently announced their new Meteor Lake architecture, and as they called it, the “biggest architectural shift in 40 years” came with a new way of making CPUs. Gone are the single, monolithic chips with everything from your cores, cache, IO and iGPU all on one bit of complicated silicon, now everything is “tiles” and “chiplets”. But… why? Why have both AMD AND Intel swapped to using this modular design? Well that’s what I’m here to explain.
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[@alilokhd4638]

I'd love to hear more about this and you gained a new subscriber

[@oppenz3723]

I think it's great for each company to chase after different design philosophy.

[@Smartphonekanalen]

Does this explain differences in lag and performances? Or are instructions and cache stil main things? Can lag be a physical interleave thing because of the overall design? The performance in cinebench becomes something else because it's not depending on lag? Is it obvious that AMD somehow tries to overcome lag with AM5 and Zen 4?

[@lflyr6287]

TechteamGB : yields efficiency is comprised out of : how small the die is to save space + how many are damaged due to overheating issues. For example, AMD-s yield efficiency is inbetween 87 % - 92 %....whereas Shintels is only from 18% - 24%....this is another self-hindering tactic to poor earning of Shintel besides being problematic CPU-s and having to high of a price.

[@RobBCactive]

According to a detailed article on 7000x3D V-cache L3D dies, they are actually manufactured on TSMC's cache optimised 7nm process, so even more mix n matching of processes with 5, 6 & 7 in one package.
The article AMD Ryzen 9 7950X3D Review: AMD Retakes Gaming Crown with 3D V-Cache on Toms Hardware has info

[@nivea878]

i think Intels aproach has bettee latency, even i dont understand this tech😂