【San Draw】Print silicone onto electronic components that need to be

Remember to turn on the CC subtitles!! 記得開啟CC字幕觀看!!
Advantages of our silicone 3D encapsulation solution:
1. Save the cost of encapsulation mold
2. Don’t worry about the bubble issue generated when the encapsulant injected into the mold
3. Don’t worry about the mold sticking issue when demolding
4. Encapsulation freedom
5. Flexibility of silicone
6. Broad temperature range of silicone, from -50˚C to 250˚C.
我們矽膠3D封裝解決方案的優勢包括：
1. 省去包裝模具的成本
2. 不必擔心在將封裝膠注入模具時產生氣泡問題
3. 不必擔心脫模時模具黏附的問題
4. 封裝型式自由多元
5. 矽膠具有彈性，能夠順應不同應用
6. 可承受溫度範圍廣泛，矽膠可適溫度範圍從-50˚C 到 250˚C
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Timeline👇🏻
0:00 Introduction 開場
0:08 The outer frames of the eight parts have all been 3D printed with silicone. 八片零件的外框均已完成列印
0:23 Start 3D Printing the inner walls of the parts.
0:54 The inner walls of the 8 parts have all been 3D printed with silicone. 八片零件的外框均已完成列印
1:03 Begin to increase the thickness of the inner walls and raise the height. 開始3D列印零件的內牆
1:12 What are our advantages? 我們的優勢
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