Thank you for showing it can be done with a hot air gun! Lots of people seem to oppose the idea but getting a bga rework station is not very economically viable for me or most people.
Remove lid before you removed chip. Under lid you will see thermal grease, it's need to be replaced. And without lid, removing and installing chip be a little bit easier.
@@estebanraggio2141 not so risky, as you think) you only need a thin plastic film (the best one is display backlight film), and little bit heat. With a film you cannot damage your chip.
Thank you for showing it can be done with a hot air gun! Lots of people seem to oppose the idea but getting a bga rework station is not very economically viable for me or most people.
Why not just use solder paste instead of those balls?
Each ball connect a pad of the chip with a pad of the motherboard socket individually. Solder paste would solder many together.
Remove lid before you removed chip. Under lid you will see thermal grease, it's need to be replaced.
And without lid, removing and installing chip be a little bit easier.
de-liding a chip is quite risky and shouldn't be done unnecessarily
@@estebanraggio2141 not so risky, as you think) you only need a thin plastic film (the best one is display backlight film), and little bit heat. With a film you cannot damage your chip.
Balls Pb free or normal Pb ?
Imagine using lead free solder
@@MC4K I'd personally would go for leaded. They are easier to use, less heat needed to melt, less brittle and they don't grow tin whiskers as easily.
Dose it really works
Yes
The most economical method which has the highest sucesss rate so yes
If you use the specialized equipment it uses the same process as by hand eg.hot air and flux