It's interesting that CMP introduces lots of particles, which you otherwise want to avoid at all costs in wafer processing. I suppose that it's tightly controlled in a way that you can get rid of them afterwards.
HI, do you have any simple article, work or book, regarding CMP parameters (downforce, table-chuck speed, slurry flow) for a standard 4 inchs silicon wafer? Thank you
you are a life saver, bless you Chris
It's interesting that CMP introduces lots of particles, which you otherwise want to avoid at all costs in wafer processing. I suppose that it's tightly controlled in a way that you can get rid of them afterwards.
thanks. your lectures are really helpful
HI, do you have any simple article, work or book, regarding CMP parameters (downforce, table-chuck speed, slurry flow) for a standard 4 inchs silicon wafer? Thank you
PDF copies of all the slides in this course are available at:
www.lithoguru.com/scientist/CHE323/course.html
Could you please explain reflow and etch back little more? Is it still used in the industry?
thank you for nice teaching =)
thank you so much.
tq
Rodel....Thanks Bill B......