Nice. A few points to make. 1. AXIEM EM simulator is an open boundary simulator that is it uses open boundaries on the sides irrespective eif the side boundary setting you make in the STACKUP Block. 2. X and Y cell size can be kept to one fifth to one tenth of the minimum width in the schematic as a rule of thumb for accurate simulations. Similarly, 5 to 10 times the substrate height for top air layer. 😊
Hi… I am running EM simulation on 6 layer PCB from 1-6G freq range .. I have changed the fee range and trying to run again and have noticed my software is unable to rerun the simulation .it shows scheduled and nothing happens after that . Can you help me what could be the reason for this ? Thanks in advance
This was very elaborative... I think this will help in our university presentation as well. I have a quick question though. Why do we have a multi-layer model in the stack up , although we have only one di-electric layer of FR4?
@@MrSimEngineering the "Di-electric layers" are defined as layer 1 and 2, right? one for Air and one for the Substrate . Why? And we do specify the Air thickness also in the Layer in Global definition in Di-electric Layer, right? Does it mean technically that Air's layer also to be considered for a certain thickness for the Impedance design? Did I ask the question in a right way ? Is it clear?
@@AmitKumarSahoo This is standard for microstrip design. The only situation where it would be different is if you are creating a suspended transmission line or you have soldermask as part of the fabrication specification. For a bare double-clad board, the side with the microstrip line will interface with air and this must be considered for proper simulation of the microstrip line. Feel free to read Chapter 3 of Pozar's Microwave Engineering to understand more about this. I should remind you that when we establish the wavelength for microstrip, it's the effective dielectric constant because half of the line is exposed to air and the other half is exposed to the dielectric material of the substrate. If not air, it's exposed to soldermask.
@@MrSimEngineering Thanks Mr. Anthony , this was really helpful in understanding the basics. I'm learning this new. Thanks again for the reference to the relevant chapter in the book as well.
when start EM simultation got error: "An error occured in the remote em simulator "EMSight". The method could not be executed due to an exception". Whats wrong? What it can be?
@@MrSimEngineering thank you for the answer. Yes, ANXIEM works well, but I wanted to understand what was wrong with the EMSight. After many hours I just installed new version of MWO(15) and everything worked ok)
Esoooooo Mr. Sim once again
Nice. A few points to make.
1. AXIEM EM simulator is an open boundary simulator that is it uses open boundaries on the sides irrespective eif the side boundary setting you make in the STACKUP Block.
2. X and Y cell size can be kept to one fifth to one tenth of the minimum width in the schematic as a rule of thumb for accurate simulations. Similarly, 5 to 10 times the substrate height for top air layer.
😊
Thank you for your contributions.
I looking forward for a Low noise transistor design in AWR tutorial from you. (using MLIN - not TLIN)
Sadly I know nothing about active RF design in AWR. Maybe I'll learn someday and make a few tutorials.
Hi… I am running EM simulation on 6 layer PCB from 1-6G freq range .. I have changed the fee range and trying to run again and have noticed my software is unable to rerun the simulation .it shows scheduled and nothing happens after that . Can you help me what could be the reason for this ? Thanks in advance
This was very elaborative... I think this will help in our university presentation as well.
I have a quick question though. Why do we have a multi-layer model in the stack up , although we have only one di-electric layer of FR4?
What do you mean?
@@MrSimEngineering the "Di-electric layers" are defined as layer 1 and 2, right? one for Air and one for the Substrate . Why?
And we do specify the Air thickness also in the Layer in Global definition in Di-electric Layer, right?
Does it mean technically that Air's layer also to be considered for a certain thickness for the Impedance design?
Did I ask the question in a right way ? Is it clear?
@@AmitKumarSahoo This is standard for microstrip design. The only situation where it would be different is if you are creating a suspended transmission line or you have soldermask as part of the fabrication specification. For a bare double-clad board, the side with the microstrip line will interface with air and this must be considered for proper simulation of the microstrip line. Feel free to read Chapter 3 of Pozar's Microwave Engineering to understand more about this.
I should remind you that when we establish the wavelength for microstrip, it's the effective dielectric constant because half of the line is exposed to air and the other half is exposed to the dielectric material of the substrate. If not air, it's exposed to soldermask.
@@MrSimEngineering Thanks Mr. Anthony , this was really helpful in understanding the basics. I'm learning this new. Thanks again for the reference to the relevant chapter in the book as well.
@@AmitKumarSahoo I'll be discussing transmission line theory in a future series I'll be posting. Stay tuned for that.
awesome
when start EM simultation got error:
"An error occured in the remote em simulator "EMSight". The method could not be executed due to an exception".
Whats wrong? What it can be?
You chose the wrong simulator. I used AXIEM in this example. Also, you may have the EMSight feature deactivated in your licensing manager.
@@MrSimEngineering thank you for the answer. Yes, ANXIEM works well, but I wanted to understand what was wrong with the EMSight. After many hours I just installed new version of MWO(15) and everything worked ok)
If I want to implement it, how to add a resistor in the design?
You'd have to add some T-junctions and feedlines gapped according to your chosen SMD sizing.
Is there going to be another tutorial like this ? Like Lange coupler
If there's enough demand, sure.
in cre d ble