ECE5973-Session 06: PCB Design Principles and Practices using Altium Designer

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  • เผยแพร่เมื่อ 27 ธ.ค. 2024
  • PCB Design Principles and Practices using Altium Designer
    ECE5973
    University of Oklahoma
    COURSE OBJECTIVE:
    Bridging the gap between industry and academia by helping our future engineers to build the right skills for their future engineering career.
    COURSE DESCRIPTION:
    This comprehensive class teaches variety of essential topics and will expand on in-depth topics to advance the attendees knowledge of using Altium Designer Schematic Capture and PCB Layout tools. The class will also dive into more challenging topics including mixed-signal high-speed PCB design considerations and techniques, differential pair routing, length matching, signal integrity aspects, circuit replication with multi-channel design, and design for manufacturing (DFM) techniques.
    The class is associated with several in-depth exercises that are used to explain and reinforce design techniques and to enable trainees to practice new features and techniques and explore more complex Altium Designer capabilities as they build a complete design from schematic to PCB including manufacturing output files.
    TOPICS:
    The class will cover all essential and advanced subjects needed to build a highly-reliable PCB design using Altium Designer. A variety of topics will be covered in each session or on multiple sessions. This will include, but not limited, the following topics:
    Schematic Design Flow
    Layout Design Flow
    Create Schematic Design
    Create Layout Design
    Placement and Re-annotation
    Routing (Manual-route, Active-route, and Auto-route)
    VIAs (Through, VIA-in-PAD, Micro, Buried, and Blind)
    VIA Stitching and Net Shielding
    Compiling & Verifying PCB Design
    Electrical Rules Check (ERC) Engine
    Layer Stackup Manager
    Create Integrated Libraries
    Importing, Exporting, and Editing 3D models
    Differential-Pairs and Busses Routing
    Cross Talk in Differential Pairs
    Differential and Common Signals
    EMI and Common Signals
    EMC and Signal Integrity in High-speed Electronics
    Modular Approach to Simplify PCB Design Process
    Output Generation (Documentation, Fabrication, Assembly, Netlist, BOM, etc)
    Planning Layout for high speed interfaces, wide buses, power distribution, etc.
    Best Practices for Mixed-Signal Grounding
    Calculating and minimizing Crosstalk
    Impedance Control
    PCBs design using high-density interconnect (HDI) techniques
    Signal Integrity and Differential Pair Routing (Length Matching, Parallel Routing, Electrical Clearance and Creepage) in High-Speed PCB Design.
    Design Guidelines for Successful Manufacturing

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