Thermal paste applied to the chips will serve the same function, but on the underside, due to the risk of a short circuit, I wouldn’t recommend using paste. Instead, I would suggest thermal pads to increase the distance between the cleaned copper pads and the aluminum heatsink. To remove chips is only to be sure there is enough solder under to proper heat transfer.
would thermal paste function the same? that way you don;t need to remove the bts chips and only the heatsink on the bottom side?
Thermal paste applied to the chips will serve the same function, but on the underside, due to the risk of a short circuit, I wouldn’t recommend using paste. Instead, I would suggest thermal pads to increase the distance between the cleaned copper pads and the aluminum heatsink. To remove chips is only to be sure there is enough solder under to proper heat transfer.