very nice lecture...easy to understand.....mam i request u to complete this whole VLSI series by providing all necessary topics....thank u...thanks a lot MAM
starts with the thermal oxidation of the silicon surface, by which an oxide layer of about 1 m thickness, for example, is created on the substrate. The entire oxide surface is then covered with a layer of photoresist, which is essentially a light-sensitive, acid-resistant organic polymer, initially insoluble in the developing solution. If the photoresist material is exposed to ultraviolet (UV) light, the exposed areas become soluble so that they are no longer resistant to etching solvents. To selectively expose the photoresist, we have to cover some of the areas on the surface with a mask during exposure. Thus, when the structure with the mask on top is exposed to UV light, areas which are covered by the opaque features on the mask are shielded. In the areas where the UV light can pass through, on the other hand, the photoresist is exposed and becomes soluble. REFER TO 'CMOS DIGITAL INTEGRATED CIRCUIT' BY SUNG MO KANG
very nice lecture...easy to understand.....mam i request u to complete this whole VLSI series by providing all necessary topics....thank u...thanks a lot MAM
Thanks for your words
Thanks you so much.... Easy to understand.
Glad to help you
Good video
Thanks for your words
Thnx.. Mam..
Glad to help you
Thanks madam
Glad to help you
Thanks u so much mam ....u teaching style is very good ...but u don't showing ur face??
Thanks for your words
tysm mam
Glad to help you
if organic polymers are use in fabrication of nmos nd pmos what will happen plx ans me someone
starts with the thermal oxidation of the silicon surface, by which an oxide layer of about
1 m thickness, for example, is created on the substrate. The entire oxide
surface is then covered with a layer of photoresist, which is essentially a light-sensitive,
acid-resistant organic polymer, initially insoluble in the developing solution. If the photoresist material is exposed to ultraviolet (UV) light, the exposed areas
become soluble so that they are no longer resistant to etching solvents. To selectively
expose the photoresist, we have to cover some of the areas on the surface with a mask
during exposure. Thus, when the structure with the mask on top is exposed to UV light,
areas which are covered by the opaque features on the mask are shielded. In the areas
where the UV light can pass through, on the other hand, the photoresist is exposed and
becomes soluble. REFER TO 'CMOS DIGITAL INTEGRATED CIRCUIT' BY SUNG MO KANG