Expert Session: Reliability Challenges of Power Electronic Modules

#5 Expert Session of Series »Powering the Future - Innovative Technologies for Power Electronics Modules with SiC and GaN Semiconductors«
Speaker: Dr.-Ing. Stefan Wagner, expert for System Reliability Assessment, Fraunhofer IZM
Power electronic components are an important basis in the transformation of mobility and energy supply. However, these modules also bring reliability challenges with them. Due to their high power density and high switching frequencies, power electronic modules are susceptible to various failure mechanisms such as thermal stress, vibrations, electrical stress, environmental humidity, and material aging. The reliability of power electronic modules depends on various factors, including design, material selection, manufacturing quality, and operating conditions. To address these challenges, careful design and manufacturing practices, as well as reliable monitoring systems, need to be implemented. Improved reliability of power electronic modules is of great importance to extend the lifespan of electronic systems and minimize downtime. Here, the challenges regarding reliability will be highlighted.
Picture: Limitless Visions - adobe.stock.com and Fraunhofer IZM
#powerelectronics #reliability #powerelectronics #fraunhoferizm #innovativetechnologies #thermalstress #microelectronics #pcb #siliconcarbide
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