Silicon Photonics - Co-Packaging Webcast
ฝัง
- เผยแพร่เมื่อ 5 ก.ย. 2024
- Alexander Janta-Polczynski, IBM Global Engineering Solutions Microelectronic Package Development Engineer and Vikas Gupta, Director of Product Management & Marketing at GLOBALFOUNDRIES provide an update on Silicon Photonics co-packaging and manufacturing techniques and discuss competitive approaches such as paralleled fiber assembly and the complaint polymer interface method.
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slides (.ppt)available ?
24:40 Automated fiber ribbon attach
16:50 Fiber Array