Bob Patti: Advanced Packaging of Semiconductors

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  • เผยแพร่เมื่อ 15 ม.ค. 2025

ความคิดเห็น • 2

  • @AdvantestInc
    @AdvantestInc 9 หลายเดือนก่อน

    In the context of heterogeneous integration, how do you see collaboration evolving across the industry to further leverage these advancements?

    • @vatsan2483
      @vatsan2483 7 หลายเดือนก่อน

      Such a good question, here are my few thoughts!! Would be interested on others as well. Honestly its now the competition that drives industries forward:
      Firstly, not necessarily all companies should go for heterogenous integration per say (bang for buck equation at play, from design & manufacturing). Yes, system Moore's scaling is the new Moore's law, but not necessarily 2.5/3D is the only way to go.
      Secondly, the industry also is driven by EDA per say and that's really a sharp enabler of things and that leads these innovations for big players.
      Third, is the inherent competition at Tech will always be a key driver for optimization. Addressing power, thermal and testability will go a long way for larger adoption.
      Finally, it's also down to standardization across players as well.