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If you want to know more, please contact our engineer: 【Minder Hu】 WeChat/Whatsup: 15813334038 Email: minder@minder-hightech.com shunyu.hu@163.com 【Jason Wang】： WeChat/Whatsup: 18998482176 Email: Jason.wang@minder-hightech.com

“Deflash” is a part of IC assembly backend process, after “Molding” then before ”Plating” to remove the “Mold Flash” with purpose to protect the plating quality. Want to know more, please contact engineer: 【Minder Hu】 WeChat/Whatsup: 15813334038 Email: minder@minder-hightech.com shunyu.hu@163.com

MDHX-M6000 multifunctional wedge and ball bonder is a manual bonding equipment used to connect the chip pads to the pads on the substrate or lead frame with platinum wire, gold wire/tape, aluminum wire, silver wire or copper wire. It is a semiconductor One of the key equipment necessary for the post-packaging process on the production line. 【Minder Hu】 WeChat/Whatsup: 15813334038 Email: minder@...

MDXZ G300HG Semi automatic wafer grinder

For semiconductor chip bonding pre-processing, plastic packaging pre-processing, photoresist removal, metal bonding and pre-processing. This is a low voltage microwave plasma cleaning system for semiconductors. By applying microwave with the frequency of 2.45GHz to the window on the wall of the vacuum cavity, a large number of continuous Plasma is generated, and the chip is cleaned by entering ...

Used for ceramic packaging, metal packaging of rectangular, circular, polygonal, anisotropic optoelectronic devices, thick film circuits, optical communication devices, quartz crystal oscillators, etc. Commonly used for precise opening and sealing of various packaging forms such as parallel sealing technology, laser sealing technology, energy storage welding technology, etc.

If you want to know more, please contact our engineer: 【Minder Hu】 WeChat/Whatsup: 15813334038 Email: minder@minder-hightech.com shunyu.hu@163.com

Wafer level Laser Soldering ball Placement Machine

Plasma surface treatment tester / Contact Angle Measuring Instrument / Contact angle tester

High Precision Die bonding machine / Die Sorting system

The customer inspects the soldering machine at the factory and prepares to ship it

Semiconductor equipment: TO wire bonder

Manual Epoxy and Eutectic Die Bonder

Battery Pack Wire Bonder Line

Battery pack wire bonder / Battery pack welding machine

Plasma surface treatmet / Plasma cleaning machine

Precise Semiconductor Dicing Saw

Automated insertion machine /Terminal Inserter from China

Auto Deep Access Gold wire bonder Stud Ball

Welcome to Minder-Hightech Guangzhou Company

Reactive Ion Etching machine / RIE / Wafer equipment / Semiconductor industry /

Wafer Dicing Saw / Semiconductor industry

MDZWSQW-1522 deep access Automatic Wire Wedge & ball Bonder for microwave product

MDZWSQW-1522 deep access Automatic Wire Wedge & ball Bonder for microwave product

Die bonder is packed and shipped today

Die attach with lower camera and angle correction

Vacuum plasma surface treatment / Вакуумная плазменная обработка поверхностей

Оборудование для очистки в плазме онлайн /vacuum plasma surface treatment equipment

Semiconductor equipment TO eutectic die bonder