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Surface Mount Process
United Kingdom
เข้าร่วมเมื่อ 10 พ.ย. 2013
www.surfacemountprocess.com/ - This channel has been created primarily to be a technical resource for surface mount process engineers but also for anyone with an interest in surface mount technology (SMT). The scope of the channel will be all aspects of the manufacturing process from solder paste printing, component placement, reflow soldering through to automatic optical inspection (AOI) - www.surfacemountprocess.com/
วีดีโอ
01005 Hand soldering and Rework using solder paste and hot air
มุมมอง 3462 หลายเดือนก่อน
01005 Hand soldering and Rework - Apply type 4 solder paste to component pads using fine tool, place 01005 component using flux-tipped fine tool, heat PCB using bottomside heater and solder component using low velocity, hot air rework tool.
StikNPeel to simplify solder paste application during QFP rework
มุมมอง 1563 หลายเดือนก่อน
The StikNPeel ™ process greatly simplifies the ability of a rework or an assembly technician to selectively print solder paste onto various areas of a PCB. Simply peel off the backing, place the StikNPeel ™ onto the PCB sliding it on/around until the apertures are aligned over the pads. The StikNPeel(TM) stencil features a repositionable adhesive backing which makes it unique. Solder paste is t...
StencilQuik for rework of Ball Grid Arrays (BGA) - standard procedure in IPC 7711 5.7.2
มุมมอง 2863 หลายเดือนก่อน
Whether you are using paste flux or solder paste StencilQuik™ BGA rework stencil greatly simplifies your rework process while providing for a more reliable connection This method features a unique stay-in-place feature which simplifies the placement while increasing the yield of reworked BGAs. These flexible solder paste BGA rework stencils remain in place on the site location becoming an integ...
EZReball for Ball Grid Arrays (BGA) - recognized in IPC 7711/21 Procedure 5.7.6.
มุมมอง 1633 หลายเดือนก่อน
The BEST EZReball™ process is an answer to your reballing problems. In fact it is recognized in IPC 7711/21 Procedure 5.7.6. as one of the ways to reball a BGA. It allows for better yields and faster reballing times. The simple nature of the EZReball™ BGA Reballing process allows even the beginning repair technician to reliably and quickly replace balls on a BGA package. Alignment is simple wit...
Spot the difference - New Year's challenge - Surface Mount Process
มุมมอง 8678 หลายเดือนก่อน
Just a bit of New Year fun :) Five images of surface mount assemblies each with eight differences. Can you find them all before the timer runs out?!? www.surfacemountprocess.com
PCB inline aqueous spray-in-air cleaning
มุมมอง 25211 หลายเดือนก่อน
When it comes to choosing which machine to select for a given process, again it depends what needs to be cleaned and what residues need to be removed, but also the required throughput. If the throughput is high with few different products, inline systems are generally chosen but the initial investment will be relatively high, along with the running costs of energy, chemistry and deionised water.
Pin-in-Paste - Connector drop during Intrusive Reflow
มุมมอง 3.3K11 หลายเดือนก่อน
Pin-in-Paste (PiP) or intrusive reflow is a soldering process used in electronics manufacturing to attach through-hole components to a printed circuit board (PCB) that has predominantly surface-mounted components. This process allows through-hole components, such as connectors, switches, or some specialized components, to be soldered using reflow soldering rather than traditional wave soldering...
Solder Wetting of Surface Mount IC during Reflow Soldering
มุมมอง 1.6K11 หลายเดือนก่อน
Solder wetting in surface mount soldering refers to the desirable process by which molten solder adheres and spreads evenly over the surfaces of the solderable components (such as component leads or terminations) and the corresponding pads on the printed circuit board (PCB) during the soldering process. Proper solder wetting is crucial for creating reliable, strong, and durable solder joints in...
Surface Mount IC Lifted Lead Coplanarity Fault during Reflow Soldering
มุมมอง 1.1K11 หลายเดือนก่อน
Surface Mount IC component lifted lead or coplanarity issues refer to a situation where the leads or terminals of a surface mount component (SMC) are not flat and not soldered to the PCB pads during reflow soldering. This lack of coplanarity can result in various problems, including poor solder joints, electrical connectivity issues, and mechanical stress on the component. To ensure the coplana...
Component Placement - Package On Package (PoP)
มุมมอง 1Kปีที่แล้ว
Component Placement - Package on Package (PoP) is an advanced semiconductor packaging technology used in electronics manufacturing, especially in the design of integrated circuits (ICs) and microchips. PoP involves stacking one semiconductor package on top of another, allowing multiple chips to be vertically integrated within a single package. This technology is commonly used in mobile devices,...
Conformal coating of SMT PCBA using automated selective spray machine process
มุมมอง 457ปีที่แล้ว
Conformal coating of SMT PCBA using automated selective spray machine process www.surfacemountprocess.com/
Electrochemical Migration (ECM) - Dendrite formation / Dendritic growth
มุมมอง 2.8Kปีที่แล้ว
Electrochemical Migration (ECM) - Dendrite formation / Dendritic growth
Moisture Sensitivity Level (MSL) - Destructive PCB delamination test
มุมมอง 3.2K2 ปีที่แล้ว
Moisture Sensitivity Level (MSL) - Destructive PCB delamination test
SMD Component Placement - 240 pin QFP at the end of the video
มุมมอง 2.7K2 ปีที่แล้ว
SMD Component Placement - 240 pin QFP at the end of the video
Ball Grid Array (BGA) rework - Removal and refit using hot air and flux
มุมมอง 27K2 ปีที่แล้ว
Ball Grid Array (BGA) rework - Removal and refit using hot air and flux
Hand soldering surface mount QFP with solder paste and hot air tool to reflow
มุมมอง 9682 ปีที่แล้ว
Hand soldering surface mount QFP with solder paste and hot air tool to reflow
Moisture Sensitivity Level (MSL) for hygroscopic surface mount components
มุมมอง 2.5K2 ปีที่แล้ว
Moisture Sensitivity Level (MSL) for hygroscopic surface mount components
10 solder paste printing process defects and solutions - under 3 mins!
มุมมอง 25K2 ปีที่แล้ว
10 solder paste printing process defects and solutions - under 3 mins!
Hand soldering surface mount components to IPC class 3
มุมมอง 27K2 ปีที่แล้ว
Hand soldering surface mount components to IPC class 3
Replacing surface mount SOIC - SMT rework made simple and easy
มุมมอง 2522 ปีที่แล้ว
Replacing surface mount SOIC - SMT rework made simple and easy
Professional hand soldering surface mount IC's to IPC class 3 - Drag/sweep soldering using flux gel
มุมมอง 8K2 ปีที่แล้ว
Professional hand soldering surface mount IC's to IPC class 3 - Drag/sweep soldering using flux gel
Using flux gel, iron with chisel tip and tinned copper wire to remove surface mount components
มุมมอง 2.4K2 ปีที่แล้ว
Using flux gel, iron with chisel tip and tinned copper wire to remove surface mount components
Surface Mount Component removal techniques using flux gel
มุมมอง 3.8K2 ปีที่แล้ว
Surface Mount Component removal techniques using flux gel
Surface Mount Process - paste printing/inspection, component placement, reflow soldering & 3D AOI
มุมมอง 27K2 ปีที่แล้ว
Surface Mount Process - paste printing/inspection, component placement, reflow soldering & 3D AOI
Surface Mount Troubleshooting Guide - solder paste printing, component placement & reflow soldering
มุมมอง 5K2 ปีที่แล้ว
Surface Mount Troubleshooting Guide - solder paste printing, component placement & reflow soldering
Solder Paste Inspection Process - 3D SPI
มุมมอง 4.3K2 ปีที่แล้ว
Solder Paste Inspection Process - 3D SPI
ERSA Versaflow 3/45 - Selective Solder Process
มุมมอง 3.2K2 ปีที่แล้ว
ERSA Versaflow 3/45 - Selective Solder Process
Reflow of surface mount gull wing device - Heel and toe fillet
มุมมอง 8462 ปีที่แล้ว
Reflow of surface mount gull wing device - Heel and toe fillet
BGA reflow soldering process double drop using lead-free solder and RoHS compliant component
มุมมอง 8K2 ปีที่แล้ว
BGA reflow soldering process double drop using lead-free solder and RoHS compliant component
Please what is the brand and model of your microscope ? THANKS
What's the soldering wire width?
nice
FCBGA1168 socket (BGA - Ball Grid Array) SO I CAN CHANGE MY CPU?????????? PLZ REPLY
After finishing solder do you clean with ipa or other specified chemical like chemtronics flux off?
Lint-free IPA wipes are best used to clean off flux residues after soldering
Could you tell me what kind of flux you use? It works perfect! 👍
Donde lo puedo descargar ?
great! what temp is adequate for the heat gun and proper/brand for flux? thanks!
When reworking BGA's using a hot air tool it is good practice to preheat the assembly to between 100°C to 150°C (212°F to 302°F) to reduce thermal shock and then set the hot air tool to a temperature dependant on the solder alloy used - Typical Range: 230°C to 250°C (446°F to 482°F) for SAC alloy with a melting pont around 217°C to 221°C (423°F to 430°F). For reworking a lead-free BGA with a hot air tool, a no-clean flux (like RMA) is typically the best choice due to its ease of use and minimal residue. It is recommended to use a flux with a high viscosity, like a gel flux to help steady the component during rework
@@SurfaceMountProcess superb!
leadfree solder right....looks like crap.
Leaded solder always flows better
Это Вы просто не умеете паять...
Are there window panes to let the gas out? You only need 50% coverage on the ground pad.
Hi, the stencil aperture for the ground pad was windowed but was too large causing too much much paste to be deposited
Just ART!
May I know how long this took?
Under typical conditions in electronic devices, dendrites might take from hours to several months to form. In accelerated test conditions (such as high humidity, high voltage, and the presence of contaminants), dendrites can form within hours to days.
Yes. Actually, I guess you might apply flux on it to accelarate this even in room temperature. So I just need to know how long you took.😅
I am trying to verify a new material SIR performance by comparing it with pure copper. Just want to know how strength the new material is in SIR.
cool
In a real practice people don't use a stencil for a solder paste if the pads are tinned.
What would be the approximative range of resistance that these dendrites can have? For 0603 package for example, are we talking hunders of kOhms or much lower?
Thanks for the question - The resistance of dendrites can generally be expected to range from a few ohms to a few kilo-ohms for metallic dendrites and up to mega-ohms for non-metallic or mixed composition dendrites. This variability is due to the influence of material properties, dendrite geometry, and environmental conditions. Hope this helps :)
Remember people , this content was taken from Mr SolderFix TH-cam channel . For real advice visit that site , not this one 👍
This is not your video. It's from @MrSolderFix channel. Stop stealing other people's work th-cam.com/video/_6OXb2lxdVI/w-d-xo.htmlsi=b2PVALs-ZoiYdtPV&t=123
may i know how long for these dendrite to grow?
The time required for dendrite growth in ECM failures can vary widely based on environmental and operational conditions. Under extreme conditions, dendrites can form within hours, while under milder conditions, it might take months or even years.
May I know how long for these dendrite to happen?
The time required for dendrite growth in ECM failures can vary widely based on environmental and operational conditions. Under extreme conditions, dendrites can form within hours, while under milder conditions, it might take months or even years.
Such heaven when there's no component sitting so closely all around the BGA... I'm struggling 😭
Share that Soldering Tweezer purchase link
Super !! ⭐⭐⭐⭐⭐
That is amazing
Temp?
What soldering flux is this in gel form?
Show how to solder with HMP PCBAs with massive heat sink
Is there enough solder left to reattach the BGA?
Doing both sides cleaning and soldering, actually yes. Been doing it for years without having rework to do later.
2x thermall stress. Some components like big mlcc's, didnt allowed to use soldering iron.
🧐
The smallest component that I soldered few years ago - 0402. But 008004.............
Saya hanya memiliki solder biasa dengan ujung runcing dan daya 40w, apakah dapat di gunakan untuk Menyolder ic qfp?
If taken from the electronic side, the only real difference on 1st pair of pictures are missing C53. Rest either makes no difference (like marking on the 0 Ohm resistor, or U2 silk) or requires additional info to know if it makes any (but usually it's not, like missing testpoints and pad might be not connected anyways, different FPGA marking might be just other batch change in marking, etc).
21
I literally would watch a video like this if it was 4 hours long... Thanks!
Question for Surface Mount Process : Is the dendrit element 'Ni or Sn' ?
The most common metal associated with dendrite formation is tin
Qual solda vocé usa ? Especificações por favor. Por exemplo com chumbo , 1 mm 0,85 mm
How to Solving problem?
Modify stencil design to reduce aperture size so that less solder paste is deposited on the component pad
❤❤
Spr🎉
wow 💥
Nice
Make 1 video with 0201 resistor 😅
Absolute SANDwich
you're talented !!
Very good video I found this problem on my job.
We have this machine in our SMT Production line in ECIL, this machine is just crazy ❤
Great video on hand soldering surface mount components really good
能用些高溫錫膏展示一下嗎？
I am incredibly doubtful of this