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UCIe Consortium
เข้าร่วมเมื่อ 21 ก.พ. 2023
The UCIe Consortium is an industry consortium dedicated to advancing UCIe™ (Universal Chiplet Interconnect Express™) technology, an open industry standard that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level. UCIe Consortium is led by key industry leaders
Advanced Semiconductor Engineering, Inc. (ASE), Alibaba, AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, NVIDIA, Qualcomm Incorporated, Samsung Electronics, and Taiwan Semiconductor Manufacturing Company. For more information, visit www.UCIexpress.org.
Advanced Semiconductor Engineering, Inc. (ASE), Alibaba, AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, NVIDIA, Qualcomm Incorporated, Samsung Electronics, and Taiwan Semiconductor Manufacturing Company. For more information, visit www.UCIexpress.org.
Introducing the UCIe 2.0 Specification Supporting 3D Packaging and Manageability System Architecture
The UCIe™ (Universal Chiplet Interconnect Express™) 2.0 Specification was released in August 2024, adding support for a standardized system architecture for manageability and holistically addresses the design challenges for testability, manageability, and debug (DFx) for the SIP lifecycle across multiple chiplets - from sort to management in the field.
The webinar explores the new features in the UCIe 2.0 specification including support for 3D packaging - offering higher bandwidth density and improved power efficiency compared to 2D and 2.5D architectures. The webinar also introduces optional manageability features and a UCIe DFx Architecture (UDA), which includes a management fabric within each chiplet for testing, telemetry, and debug functions. It also enables vendor agnostic chiplet interoperability across a flexible and unified approach to SIP management and DFx operations.
Presenter: Dr. Debendra Das Sharma, UCIe Consortium Chairman, and Intel Senior Fellow and co-GM Memory and I/O Technologies, Intel Corporation
The webinar explores the new features in the UCIe 2.0 specification including support for 3D packaging - offering higher bandwidth density and improved power efficiency compared to 2D and 2.5D architectures. The webinar also introduces optional manageability features and a UCIe DFx Architecture (UDA), which includes a management fabric within each chiplet for testing, telemetry, and debug functions. It also enables vendor agnostic chiplet interoperability across a flexible and unified approach to SIP management and DFx operations.
Presenter: Dr. Debendra Das Sharma, UCIe Consortium Chairman, and Intel Senior Fellow and co-GM Memory and I/O Technologies, Intel Corporation
มุมมอง: 1 388
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The UCIe™ (Universal Chiplet Interconnect Express™) 1.1 Specification was released in August 2023, delivering valuable improvements to the chiplet ecosystem, extending reliability mechanisms to more protocols and supporting broader usage models. This webinar provides an overview of enhancements made in the UCIe 1.1 specification and architectural specification attributes to define system setups...
UCIe™ Packaging Technologies Webinar
มุมมอง 4.5Kปีที่แล้ว
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Introduction to UCIe™
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UCIe™ - Universal Chiplet Interconnect Express™ - is an open industry standard founded by the leaders in semiconductors, packaging, IP suppliers, foundries, and cloud service providers to address customer requests for more customizable package-level integration. The newly formed UCIe Consortium fosters an open chiplet ecosystem by offering high-bandwidth, low-latency, power-efficient, and cost-...
Highly Informative, Special thanks to the Dr.Debendra for giving us an excellent overview of UCIe.
remote control chip option has to be optional; I dont want to leave even a possibility for a third party to backdoor my comp even if its turned off.
How to handle the TLP CFG packets over mainband
i want the presentation
How to get UCIe protocol specification.
where we can get the specification for UCIe
Which Streaming Protocol should we support when designing UCIe Protocol Layer? Because there are many vendor streaming protocol such as AXI Streaming or CXS ...
It is generic it should support all the protocol.
Yess It support all of them whether it's vendor specific (like AMBA's protocol) or any of the user specific. Because above of the protocol layer one more hidden layer present called 'Translator' that extract the basic info from vendor specific protocol and then forwarded to Protocol layer.
@@amirsharfuHi, can you provide more information regarding this hidden layer. Because as far as I know I haven't encountered any such layer. For streaming protocol ucie just picks up the data and forwards it.
Good material to quick-know ucie
Hello, I enjoyed reading your article but I have a question? Will the frequency (lclk) on the RDI interface provided to the Adapter & PHY be fixed at 2GHz or variable to meet the bandwidth of 4-32GTs?
Hello, I enjoyed reading your article but I have a question? Will the frequency (lclk) on the RDI interface provided to the Adapter & PHY be fixed at 2GHz or variable to meet the bandwidth of 4-32GTs?
Very Informative.. Thanks!
Great webinar for full picture of packaging technologies. Thanks.
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