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Science & Tech (@SciTechs)
เข้าร่วมเมื่อ 16 ส.ค. 2023
WELCOME: To Science & Tech (@SciTechs), where we explore the wonders of science and technology.
MISSION: To make science and technology enjoyable and comprehensible for everyone.
GOAL: To bridge the gap between curiosity and understanding through our videos and courses.
We're here to turn learning into an exciting journey of discovery.
AUDIENCE: High-school students, college students, adults of all ages interested in science & technology.
VIDEOS & COURSES:
SCIENCE: Immerse yourself in the wonders of physics, chemistry, biology, and more.
TECHNOLOGY: From software to robotics, artificial intelligence to digital innovation, we demystify the intricacies of modern tech.
PLAYLISTS: Navigate your learning journey seamlessly using our curated playlists. Each pathway leads you step by step, gradually building your knowledge.
BENEFITS: Students, our resources complement your learning, making intricate concepts understandable and engaging.
MISSION: To make science and technology enjoyable and comprehensible for everyone.
GOAL: To bridge the gap between curiosity and understanding through our videos and courses.
We're here to turn learning into an exciting journey of discovery.
AUDIENCE: High-school students, college students, adults of all ages interested in science & technology.
VIDEOS & COURSES:
SCIENCE: Immerse yourself in the wonders of physics, chemistry, biology, and more.
TECHNOLOGY: From software to robotics, artificial intelligence to digital innovation, we demystify the intricacies of modern tech.
PLAYLISTS: Navigate your learning journey seamlessly using our curated playlists. Each pathway leads you step by step, gradually building your knowledge.
BENEFITS: Students, our resources complement your learning, making intricate concepts understandable and engaging.
4154a Semiconductor Packaging -- Metrology -- Strain Gauges
**Understanding Strain Gauges in Semiconductor Packaging**
Explore the essential role of strain gauges in semiconductor packaging from "Semiconductor Packaging: John D. Thomas, Alex Ruth" Book 4, Section 1, Chapter 5, Topic 4.
**Introduction:**
Delve into the world of strain gauges, vital sensors in semiconductor packaging that measure mechanical strain and deformation. Learn how these devices provide crucial insights into structural integrity, reliability, and performance under various mechanical, thermal, and environmental stresses.
**Key Points Covered:**
- **Principles of Strain Gauges:** Discover how strain gauges work based on electrical resistance changes due to mechanical strain, utilizing Wheatstone bridge configurations for accurate measurement.
- **Types of Strain Gauges:** Explore metal foil, semiconductor, thin film, and bonded resistance strain gauges, each offering unique benefits like high sensitivity, temperature stability, and compatibility with microelectronics.
- **Applications in Semiconductor Packaging:** Learn how strain gauges are applied in structural testing, reliability assessment, material characterization, process control, and thermal management within semiconductor packaging.
- **Advantages and Advancements:** Understand the advantages and recent advancements in strain gauge technology that enhance their precision, reliability, and applicability in demanding semiconductor packaging environments.
**Conclusion:**
Strain gauges are indispensable tools in semiconductor packaging, enabling precise measurement of mechanical behavior crucial for optimizing designs, ensuring reliability, and enhancing product performance. Stay informed on advancements in strain gauge technology by liking, sharing, and subscribing for more insights into semiconductor packaging and electronics industry innovations.
Explore the essential role of strain gauges in semiconductor packaging from "Semiconductor Packaging: John D. Thomas, Alex Ruth" Book 4, Section 1, Chapter 5, Topic 4.
**Introduction:**
Delve into the world of strain gauges, vital sensors in semiconductor packaging that measure mechanical strain and deformation. Learn how these devices provide crucial insights into structural integrity, reliability, and performance under various mechanical, thermal, and environmental stresses.
**Key Points Covered:**
- **Principles of Strain Gauges:** Discover how strain gauges work based on electrical resistance changes due to mechanical strain, utilizing Wheatstone bridge configurations for accurate measurement.
- **Types of Strain Gauges:** Explore metal foil, semiconductor, thin film, and bonded resistance strain gauges, each offering unique benefits like high sensitivity, temperature stability, and compatibility with microelectronics.
- **Applications in Semiconductor Packaging:** Learn how strain gauges are applied in structural testing, reliability assessment, material characterization, process control, and thermal management within semiconductor packaging.
- **Advantages and Advancements:** Understand the advantages and recent advancements in strain gauge technology that enhance their precision, reliability, and applicability in demanding semiconductor packaging environments.
**Conclusion:**
Strain gauges are indispensable tools in semiconductor packaging, enabling precise measurement of mechanical behavior crucial for optimizing designs, ensuring reliability, and enhancing product performance. Stay informed on advancements in strain gauge technology by liking, sharing, and subscribing for more insights into semiconductor packaging and electronics industry innovations.
มุมมอง: 29
วีดีโอ
6253b Semiconductor Packaging -- Heterogeneous Integration 2 -- Co-Packaging Optics 2
มุมมอง 114 หลายเดือนก่อน
Video Description: Explore the future of semiconductor packaging with "Semiconductor Packaging: John D Thomas, Alex Ruth," Book 6, Section 2, Chapter 5, Topic 3 (part 2), as we delve into the challenges, considerations, and promising opportunities of Co-Packaging Optics (CPO). Challenges and Considerations in Co-Packaging Optics (CPO): Discover the challenges posed by Co-Packaging Optics (CPO) ...
6255 Semiconductor Packaging -- Heterogeneous Integration 2 -- Bandwidth Scaling
มุมมอง 84 หลายเดือนก่อน
Explore the pivotal role of bandwidth scaling in "Semiconductor Packaging: John D Thomas, Alex Ruth," Book 6, Section 2, Chapter 5, Topic 5. Bandwidth scaling is crucial for meeting the escalating demands of modern data-intensive applications, from high-speed networking to AI, cloud computing, and multimedia processing. Introduction: In the landscape of semiconductor packaging, bandwidth scalin...
6254 Semiconductor Packaging -- Heterogeneous Integration 2 -- Die to Die Interconnects
มุมมอง 114 หลายเดือนก่อน
Discover the future of semiconductor packaging with "Semiconductor Packaging: John D Thomas, Alex Ruth," Book 6, Section 2, Chapter 5, Topic 4, as we explore Die-to-Die Interconnects: Enabling Seamless Integration in Multi-Chip Packages. Introduction: In the realm of semiconductor packaging, die-to-die interconnects emerge as pivotal technology enabling the seamless integration of individual se...
6253a Semiconductor Packaging -- Heterogeneous Integration 2 -- Co-Packaging Optics
มุมมอง 404 หลายเดือนก่อน
Dive into the future of semiconductor packaging with "Semiconductor Packaging: John D Thomas, Alex Ruth," Book 6, Section 2, Chapter 5, Topic 3, as we explore the revolutionary realm of Co-Packaging Optics (CPO) and its transformative impact on bandwidth scaling. Unveiling Co-Packaging Optics (CPO): Discover how Co-Packaging Optics (CPO) integrates optical components like lasers, modulators, an...
6252 Semiconductor Packaging -- Heterogeneous Integration 2 -- Plug & Play D2D link standardization
มุมมอง 54 หลายเดือนก่อน
Video Description: Explore the future of semiconductor packaging with "Semiconductor Packaging: John D Thomas, Alex Ruth," Book 6, Section 2, Chapter 5, Topic 2, as we delve into the transformative concept of "Plug and Play" through Die-to-Die (D2D) link standardization. Unveiling D2D Link Standardization: Discover how Die-to-Die (D2D) link standardization revolutionizes semiconductor packaging...
6251 Semiconductor Packaging -- Heterogeneous Integration 2 -- 2D/3D die to die interconnects
มุมมอง 234 หลายเดือนก่อน
Explore the forefront of semiconductor packaging with "Semiconductor Packaging: John D Thomas, Alex Ruth," Book 6, Section 2, Chapter 5, Topic 1, as we delve into the critical realm of die-to-die interconnects and their pivotal role in enabling continued bandwidth scaling. Unveiling Die-to-Die Interconnects: Discover the essential strategies and advancements driving semiconductor packaging to m...
6245 Semiconductor Packaging -- Heterogeneous Integration -- Applications
มุมมอง 874 หลายเดือนก่อน
Dive into the cutting-edge world of semiconductor packaging with "Semiconductor Packaging: John D Thomas, Alex Ruth," Book 6, Section 2, Chapter 4, Topic 5, as we explore the transformative concept of heterogeneous integration. Exploring Heterogeneous Integration: Discover how heterogeneous integration revolutionizes electronic systems by seamlessly combining diverse components and technologies...
6244 Semiconductor Packaging -- Heterogeneous Integration -- Principles
มุมมอง 44 หลายเดือนก่อน
Explore the dynamic realm of semiconductor packaging with "Semiconductor Packaging: John D Thomas, Alex Ruth," Book 6, Section 2, Chapter 4, Topic 4, as we delve into the transformative concept of heterogeneous integration. Understanding Heterogeneous Integration: Discover how heterogeneous integration revolutionizes modern electronics by seamlessly integrating diverse materials, processes, and...
6243b Semiconductor Packaging -- Heterogeneous Integration -- Interconnect Scaling 2
มุมมอง 34 หลายเดือนก่อน
Dive into the intricacies of semiconductor packaging with "Semiconductor Packaging: John D Thomas, Alex Ruth," Book 6, Section 2, Chapter 4, Topic 3 (part 2), as we explore the pivotal role of interconnect scaling in modern electronic systems. Interconnect Scaling in Emerging Technologies: Discover why interconnect scaling is crucial for emerging technologies such as IoT devices, wearables, and...
6243a Semiconductor Packaging -- Heterogeneous Integration -- Interconnect Scaling
มุมมอง 44 หลายเดือนก่อน
Explore the realm of semiconductor packaging with "Semiconductor Packaging: John D Thomas, Alex Ruth," Book 6, Section 2, Chapter 4, Topic 3, as we delve into the critical domain of interconnect scaling. Introduction to Interconnect Scaling: Understand the foundational role of interconnect scaling in semiconductor packaging, where dimensions of wires, traces, and vias are reduced to meet the de...
6242 Semiconductor Packaging -- Heterogeneous Integration -- Interconnect Scaling MCPs
มุมมอง 104 หลายเดือนก่อน
Dive into the world of semiconductor packaging with "Semiconductor Packaging: John D Thomas, Alex Ruth," Book 6, Section 2, Chapter 4, Topic 2, as we explore the critical role of interconnect scaling in multi-chip packages (MCPs). Introduction to Interconnect Scaling: Discover the significance of interconnect scaling, where the dimensions of wires, traces, and vias are reduced to accommodate hi...
6241 Semiconductor Packaging -- Heterogeneous Integration -- Introduction
มุมมอง 114 หลายเดือนก่อน
Explore the revolutionary concept of heterogeneous integration in semiconductor packaging with "Semiconductor Packaging: John D Thomas, Alex Ruth," Book 6, Section 2, Chapter 3, Topic 4. Introduction to Heterogeneous Integration: Discover how heterogeneous integration reshapes semiconductor packaging by combining diverse components-materials, technologies, and functionalities-into unified syste...
6234 Semiconductor Packaging -- Trends 2 -- High-speed High-frequency Operation
มุมมอง 64 หลายเดือนก่อน
Delve into the complexities of high-speed and high-frequency operation in semiconductor packaging with "Semiconductor Packaging: John D Thomas, Alex Ruth," Book 6, Section 2, Chapter 3, Topic 4. Meeting the Challenges of High-Speed Operation: Explore the critical role of semiconductor packaging in supporting high-speed data communication, 5G connectivity, and AI applications. Discover how advan...
6233 Semiconductor Packaging -- Trends 2 -- Increasing Complexity & Integration
มุมมอง 94 หลายเดือนก่อน
Dive into the complexities of semiconductor packaging with "Semiconductor Packaging: John D Thomas, Alex Ruth," Book 6, Section 2, Chapter 3, Topic 3. Navigating Increasing Complexity in Electronics: Explore the evolving landscape of advanced electronics where demands for higher integration and functionality drive innovation in semiconductor packaging. Discover how cutting-edge technologies are...
6232 Semiconductor Packaging -- Trends 2 -- Future Solutions
มุมมอง 94 หลายเดือนก่อน
6232 Semiconductor Packaging Trends 2 Future Solutions
6231 Semiconductor Packaging -- Trends 2 -- Challenges
มุมมอง 84 หลายเดือนก่อน
6231 Semiconductor Packaging Trends 2 Challenges
6224b Semiconductor Packaging -- Trends -- Advanced Packaging 2
มุมมอง 54 หลายเดือนก่อน
6224b Semiconductor Packaging Trends Advanced Packaging 2
6224a Semiconductor Packaging -- Trends -- Advanced Packaging
มุมมอง 74 หลายเดือนก่อน
6224a Semiconductor Packaging Trends Advanced Packaging
6223 Semiconductor Packaging -- Trends -- Improvements
4 หลายเดือนก่อน
6223 Semiconductor Packaging Trends Improvements
6222b Semiconductor Packaging -- Trends -- Heterogeneous Integration 2
มุมมอง 14 หลายเดือนก่อน
6222b Semiconductor Packaging Trends Heterogeneous Integration 2
6222a Semiconductor Packaging -- Trends -- Heterogeneous Integration 1
มุมมอง 114 หลายเดือนก่อน
6222a Semiconductor Packaging Trends Heterogeneous Integration 1
6221 Semiconductor Packaging -- Trends -- Introduction
มุมมอง 94 หลายเดือนก่อน
6221 Semiconductor Packaging Trends Introduction
6211 Semiconductor Packaging -- Advanced Packaging -- Introduction
มุมมอง 84 หลายเดือนก่อน
6211 Semiconductor Packaging Advanced Packaging Introduction
6139 Semiconductor Packaging -- Reliability Testing Implications
มุมมอง 64 หลายเดือนก่อน
6139 Semiconductor Packaging Reliability Testing Implications
6138 Semiconductor Packaging -- Reliability Testing Challenges
มุมมอง 104 หลายเดือนก่อน
6138 Semiconductor Packaging Reliability Testing Challenges
6136 Semiconductor Packaging -- Reliability Testing Methods
มุมมอง 194 หลายเดือนก่อน
6136 Semiconductor Packaging Reliability Testing Methods
6135 Semiconductor Packaging -- Reliability Testing Significance
มุมมอง 84 หลายเดือนก่อน
6135 Semiconductor Packaging Reliability Testing Significance
6134a Semiconductor Packaging -- Reliability Testing -- Infant Mortality Test
มุมมอง 124 หลายเดือนก่อน
6134a Semiconductor Packaging Reliability Testing Infant Mortality Test
6133b Semiconductor Packaging -- Reliability Testing -- Use Tests 2
มุมมอง 24 หลายเดือนก่อน
6133b Semiconductor Packaging Reliability Testing Use Tests 2
I'm am quite familiar with atmospheric pressure, but I did learn about plasma and Bernoulli's principle. It is quite and interesting concept.
I have learned about buoyancy before, but it was a nice review. I especially liked the different and more in-depth explanation of Pascal's principle. I also got to learn about how capillarity works.
In this lecture, I learned that to get density, you must divide mass by volume
In this lecture, I learned where the nucleus is located- in the center of an atom
Thank you for the lecture. It was nice to see and learn how we have measured escape speeds on various planets and bodies within the Solar System.
We went over a little bit already on the parabola and projectile motion in a previous lecture, but it's nice to see it in more detail. However, it was very interesting to learn about how the parabola is actually a part of an ellipse that extends within the Earth. It was great to learn about ellipses and satellites in general.
Einstein's Theory of Gravitation is very interesting to learn about as he proposes that distortions of space-time is created by mass and energy. The trampoline metaphor definitely helped.
I found this lesson very informative. It was very interesting to learn how spring tide and neap tide is the product of the gravitational force of the moon and sun. I knew what they were, but not why that was.
This was a great expansion on rotational motion. I was able to learn the difference between the difference between centrifugal and centripetal force.
This lecture taught me a great deal about the many things that can go into rotational motion. This includes torque and rotational inertia.
This lecture was very useful. Especially the concept of machines introduced into this physics lesson, it provides change in the conservation of energy and introduces efficiency.
This lecture was very useful in refreshing me and relearning the concept of work and power as well as the concept of the work-energy theorem.
I was able to get a better understanding of impulse and learn about the relationship between momentum and impulse.
I learned the relationship of the horizontal and vertical vectors that resulted in the resultant vector.
This lesson taught me why guns need to be heavy.
In this lecture, I learned that mass is different from weight.
in this lecture, I learned that if you multiple the average speed and the time traveled, you can get the total distance covered by an object.
I learned that for every action there is an equal and opposite reaction
I was able to learn more on the difference between mass and weight. The correlation between acceleration and mass following Newton's Second Law of Motion.
I managed to review and relearn a little more on equations for free fall and a little sneak peak of velocity when traveling in a parabola.
in this lecture i learned that there is still a lot to learn about matter
In this lecture I learned the equations for acceleration, velocity, and free fall velocity and distance.
In this lecture, I learned that matter is still unexplained.
In this lecture, I learned the definition of velocity and the difference from acceleration.
In this module I learned that we do not really understand matter.
In this module I learn the formula d=1/2gt^2
In this lecture, I learned that inertia is applied in our lives constantly. Our bodies are always moving and resisting the change in motion.
In this lecture, I learned that the scientific method is not always used by scientist. Also, a theory is just a large amount of information but could be false.
In this lecture I learned that an example of a scientific method is The Big Bang Theory or the theory of evolution.
I learned that a moving object can be in equilibrium when the force applied and the force of friction are equal each other. This creates a linear equilibrium with a net force of 0.
I learned about the equilibrium rule in this lecture
In this lecture I learned what the equilibrium rule is.
In this lecture I learned the difference between theories and laws.
Thank you for the lecture! I learned all these concepts before, but it has been quite a long time so it was a nice review. I especially enjoyed the explanation of the concept of weight affecting speed being correct in both Aristotle's and Galileo's theory. However, the thing I learned most was the concept of relative motion like with the examples you gave of the moving Earth. It was very interesting.
I usually think that the terms given within this lecture are very straightforward, but I do find that the examples you give to explain them are great, especially your explanation on the complexities of theories, facts, and laws. Afterall, what we have establish may not necessarily be the truth and applicable in all situations.
Whaaat!
I learned that the photoelectric effect is emission of electrons from a metal surface when light shines on it.
I learned that phosphorescence differs from fluorescence by a delay between excitation and de-excitation
I learned that the microworld is quantum theory.
I learned that excition is the process of moving an electron to a different energy level.
In this lecture I learned that quantum physics plays a big role in the photography phenomenon and is utilized in biopsy tests.
In this lecture I learned that white light is made up of different wave colors and a laser is made up of one coherent wave color and same wave lengths.
In this lecture I learned that Albert Einstein got his Nobel prize for explaining the photoelectric effect in the context of quantum mechanics!
Planck’s Constant represents the energy of the photon being measured which is equal to the frequency of the light wave. Planck’s Constant Equation is characterized as E 🟰 h ✖️ f
To first understand excitation we must understand the further an electron is from an atom’s nucleus , the greater its potential energy. While electrons typically remain in their prescribed energy level that orbits a nucleus, a bombarding free electron can collide with a bounded electron, thus raising it to a higher energy level, which then puts that electron in a state of excitation.
Dispersion is phenomena where light rays, depending on their frequencies, get “dispersed” or separated when traveling through a medium.
I learned that Planck's constant is fundamental, h, which relates the energy of light quanta to their frequency.
I learned that a spectroscope breaks the light from a single material into its component colors the way a prism splits white light into a rainbow.
I learned that the emission spectrum is the distribution of wavelengths in the light from a luminous source.
In this lecture I learned that the peak frequency is proportional to the temperature. So, the higher you heat something the greater the average peak frequency.